ERS Company earned many awards, accolades, and distinguished contributions. Among those received include:
2004 ASME Worcester Reed Warner Medal for “outstanding contributions to the permanent literature of engineering through a series of papers in Mechanical, Microelectronic, and Optoelectronic Engineering, which established a new discipline known as the Structural Analysis of Microelectronic and Photonic Systems”, 2004
2004 ASME Award for valued services in advancing engineering education as Member-at-Large of the Board on Professional Development, 2004
Laser Focus World Award / for the paper “Analytical Modeling Plays a Crucial Role in Photonics Engineering”, published in the May 2002 issue of the journal, 2002 APS Fellowship Award for outstanding contributions to Materials and Industrial Physics, 2003
2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry by advancing the art and science of predictive modeling in these areas, and laying the foundation of a discipline "Structural Analysis in Microelectronics and Photonics Systems”. For providing leadership in the application of Engineering and Applied Mechanics principles and methods to problems of physical design in microelectronics and photonics.
2001 ASME Award for valued services in advancing the engineering profession as keynote speaker on the topic “The Future of Microelectronics and Photonics, and the Role of Packaging”
2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society, and as a recognition of the pioneering work in Materials and Mechanical Engineering related to microelectronics and fiber-optics structures
2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering
1999 ASME (National) Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering SPE Fellowship Award for distinguished contributions to the scientific and engineering knowledge related to plastics, 1998
IEEE CPMT Distinguished Lecturer Award for teaching successful short courses and tutorials, and presenting invited and key-note talks in the field of Physical (Mechanical) Design and Reliability of Microelectronic and Photonic Systems, 1998
ASME INTERPack’97 General Chair Award for organizing and conducting the International Conference on Microelectronics and Photonics Packaging, Hawaii, June 15-19, 1997
ASME INTERPack’97 General Session Chair Award for organizing and conducting the General (Opening) Session of the International Conference on Microelectronics and Photonics Packaging, Hawaii, June 15-19, 1997.
ASME INTERPack’97 Session Chair Award for organizing and conducting a Session “Reflow Cracking in Plastic Packages”, INTERPack’97, Hawaii, June 15-19, 1997 (co-chairs: M. Shiratori, L. Nguyen)
Distinguished Member of Technical Staff Award for developing engineering mechanics methods to predict the performance and reliability of structures, and in manufacturing Lucent Technologies products, Bell Laboratories, 1996.
ASME Fellowship Award for outstanding pioneering contributions to several important fields of Applied and Engineering Mechanics, and Materials Science and Engineering, American Society of Mechanical Engineering, 1996
IEEE Fellowship Award for distinguished contributions to the field of the application of Engineering Mechanics and Materials Engineering to the analysis and physical design of microelectronic and fiber optic systems, Institute of Electrical and Electronic Engineers, 1994
Awards for valued services in advancing the engineering profession as Member of the Executive Committee and Chairman of the Honors and Awards Committee, American Society of Mechanical Engineers, Electrical and Electronic Packaging Division, 1994, 1995, 1996.
Award for valued services in advancing the engineering profession and for presenting the highlight topic lecture "The Future of Microelectronics and Fiber Optics and the Role of Materials and Mechanics'', International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers, Materials Division, 1994
Merit (Extraordinary Contribution) Award for studies on modeling of stresses in, and optimization of manufacturing of, plastic electronic packages and optical fibers, AT&T Bell Laboratories, 1993
ASME Award for distinguished contributions in the field of the application of Engineering Mechanics to Electronic Packaging, and for co-founding the Journal of Electronic Packaging, American Society of Mechanical Engineers, 1992
Outstanding Paper Award for a paper on mechanical design and reliability of ceramic electronic packages, Institute of Electrical and Electronic Engineers, 1990
ASME awards for valued services in establishing, organizing, and conducting annual Symposia on Structural Analysis in Microelectronics and Fiber Optics, 1989-1995
ISHM Best Paper Award for a paper on thermal stresses in adhesively bonded and soldered assemblies, International Society for Hybrid Microelectronics, 1986
Extraordinary Contribution Award for studies on analytical stress modeling for advanced VLSI packages, Bell Laboratories, 1986
Best Paper Award for a study on structural reliability of ocean structures, Krylov Research Society for Shipbuilding Industry, Russia, 1974