RELIABILITY ENGINEERING

EPHRAIM SUHIR, Ph.D.


Bell Laboratories, Physical Sciences and Engineering Research Division, Murray Hill, NJ, USA


Technical University, Department of Electronic Materials, Vienna, Austria


University of California,Department of Electrical Engineering, Santa  Cruz, CA, USA

University of Maryland,Department of Mechanical Engineering, College Park, MD, USA


ERS  Co., 727 Alvina Ct.,Los Altos, CA   94024,   USA


www.ERSuhir.com

e-mail: suhire@aol.com  
e.suhir@ieee.org


Tel. 650.969.1530      Cell. 408-410-0886
 

AREAS OF PROFESSIONAL INTERESTS 

·  Applied Mathematics, Applied and Mathematical Physics, Materials Science, Applied Mechanics, Elasticity Theory,

·  Applied Probability, Probabilistic Analyses and Probability-Based Physical Designs, Probabilistic Methods in Reliability Engineering, Probabilistic Risk   

          Assessment and Management

·   Information and Communication Technologies: Probabilistic Methods and Hardware Aspects

·   Technical Diagnostics, Prognostics and Health Monitoring (PHM) 

·    Analytical (“Mathematical”) Modeling in Applied Science Problems

·    Photonics, Fiber Optics, Mechanics of Optical Fibers,  Design for Reliability (DfR) of Photonics Systems

·    Composite and “Smart” Materials and Systems, Nano-Materials and Nano-Engineering

·    Thin Film Mechanics and Physics 

·    Shock and Vibrations Analyses, Random Vibrations, Dynamic Response of  Materials and Systems to Shocks and Vibrations 

·    Thermal Stress Analysis and Thermal Stress Failures: Prediction and Prevention

·    Polymeric Materials and  Applications in Electronics and Photonics 

·    “Human-in-the-Loop”:  Probabilistic Modeling of Human-Equipment-Environment Interaction and Missions Success and Safety

 

EDUCATION

·    Ph.D., Dept. of Mechanics and Mathematics,  Moscow University, Moscow, Russia, 1968

·    MS, Dept.  of Naval Architecture, Polytechnic Institute,  Odessa, Ukraine, 1960


EMPLOYMENT (after arriving to the US in 1980)

·     1980-1984 Exxon Corporation, Exxon Research and Engineering Co., Florham Park, NJ

·     1984-2001 Bell Laboratories, Physical Sciences and Engineering Research Division, Murray Hill, NJ

·     2001-         University   of California, Dept.  of Electrical Engineering, Santa Cruz, CA

 

UNIVERSITY COURSES TAUGHT

·      Applied probability for engineers and physicists, Departments of Mathematics and Physics, Institute of Naval Architecture, Nikolayev, Ukraine, 1970-1975

·      Mathematical foundations of engineering elasticity and structural analysis, Departments of Mathematics and Structural Analysis, Nikolayev, Ukraine, 1970-1975

·      Probabilistic methods in ship structural analysis, 1970-1975

·      Nonlinear  and stochastic problems in mechanics and naval architecture, Department of Structural Analysis, Nikolayev, Ukraine, 1972-1975

·      Probability theory and its applications in engineering and applied science, Department of mathematics, Kaunas Polytechnic Institute, Kaunas, Lithuania, 1975-1979

·      Reliability of electronic and photonic materials, Rutgers University, Piscataway, New Jersey, USA, 1987-1990

·      Basics of Electronics Reliability, UC-Santa Cruz, Santa Cruz, CA, USA, 2002-

·      Fundamentals of optoelectronics and photonics, UC-Santa Cruz, Santa Cruz, CA, USA, 2003-2004

 

SOCIETIES 

·      National Academy of Engineering and Applied Science, Ukraine, Foreign Full Member (Academician)

·      American Physical Society (APS), Fellow

·      Institute of Physics (IoP), United Kingdom, Fellow

·      Institute of Electrical and Electronics Engineers (IEEE), Fellow

·      American Society of Mechanical Engineers (ASME), Fellow

·      Society of Plastics Engineers (SPE), Fellow

·      International  Microelectronics and Packaging Society  (IMAPS), Fellow

·      Society of Optical Engineers (SPIE), Fellow

·      American Institute of Aeronautics and Astronautics (AIAA), Member

 

AWARDS (Shortened List)

·      2012 SPIE Fellowship Award for outstanding and pioneering contributions to photonics engineering

·      2012 IMAPS Fellowship Award for distinguished contributions to packaging of microelectronic devices

·      2012 ASME Santa Clara Valley Section Outstanding Achievement Award in grateful appreciation  for outstanding contribution to the engineering community; bestowed at the ASME Industry Honors Dinner, April 19, 2012

·      2009 IEEE CPMT Society Award in appreciation of sustained contribution to the ECTC, 10 Years

·      2008 Fulbright Scholarship in Information Technologies, as pertinent to the materials and structures in;

                 reliability, physical design, packaging, and modeling of; and

                 risk analyses and probabilistic assessments for, the evaluation of the behavior and performance of hardware and devices in information and communication

                               technologies and systems

·      2004 ASME Worcester Reed Warner Medal for “outstanding contributions to the permanent literature of engineering through a series of papers in Mechanical, Microelectronic, and Optoelectronic Engineering, which established a new discipline known as the Structural /Analysis of Microelectronic and Photonic Systems”,

·      2004 ASME  Award for valued services in advancing engineering education as Member-at-Large of the Professional Development Board

·      2002 Laser Focus World Award for the paper “Analytical Modeling Plays a Crucial Role in Photonics Engineering”, May 2002 issue 

·      2002 APS Fellowship Award for distinguished contributions to the field of analytical modeling of the physical behavior and reliability of microelectronic and photonic materials and systems.

·      2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry by advancing the art and science of predictive modeling in these areas, and laying the foundation of a discipline "Structural Analysis in Microelectronics and Photonics
Systems”. For providing leadership in the application of Engineering and Applied Mechanics principles and methods to problems of physical design in microelectronics and photonics.

·      2001 ASME Award for valued services in advancing the engineering profession as keynote speaker on the topic “The Future of Microelectronics and Photonics, and the Role of Packaging”

·      2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society, and as a recognition of the pioneering work in Materials and Mechanical Engineering related to microelectronics and fiber-optics structures

·      2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering

·      1999 ASME (National) Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering

·      1998 SPE Fellowship Award for distinguished contributions to the scientific and engineering knowledge related to plastics 

·      1998 IEEE CPMT Distinguished Lecturer Award for teaching successful short courses and tutorials, and presenting invited and key-note talks in the field of Physical  (Mechanical) Design and Reliability of Microelectronic and Photonic Systems,

·      1997 ASME INTERPack’97 General Chair Award for organizing and conducting the  International Conference on Microelectronics and Photonics Packaging, Hawaii, June 15-19, 1997

·      1996 Bell Labs Distinguished Member of Technical Staff Award for developing engineering mechanics methods to predict the performance and reliability of structures, and in  manufacturing Lucent Technologies products, Bell Laboratories, 1996.

·        
1996 ASME
Fellowship Award for outstanding
pioneering contributions to several important fields of Applied and Engineering
Mechanics, and Materials Science and Engineering, American Society of
Mechanical Engineering, 1996

·        
1994 IEEE
Fellowship Award for distinguished
contributions to the field of the application of Engineering Mechanics and
Materials Engineering to the analysis and physical design of microelectronic
and fiber optic systems, Institute of Electrical
and Electronic Engineers, 1994

·        
Awards for valued
services in advancing the engineering profession as Member of the
Executive Committee and Chairman of the Honors and Awards Committee, American
Society of Mechanical Engineers, Electrical and Electronic Packaging Division,
1994, 1995, 1996.

·        
1994 ASME,
Materials Division Award for valued services in
advancing the engineering profession and for presenting the highlight
topic lecture  "The Future of
Microelectronics and Fiber Optics and the Role of Materials and Mechanics'',
International Mechanical Engineering Congress and Exposition, , 1994

·        
1993
AT&T Bell Laboratories Merit
(Extraordinary
Contribution) Award for studies on modeling of stresses in, and
optimization of manufacturing of, plastic electronic packages and optical
fibers, 

·        
1992 ASME Award for distinguished contributions in the field of
the application of Engineering Mechanics to Electronic Packaging, and for
co-founding the Journal of Electronic Packaging, American Society of Mechanical
Engineers 

·        
1990
Outstanding Paper Award for a
paper on mechanical design and reliability of ceramic electronic packages,
Institute of Electrical and Electronic Engineers 

·        
1986 ISHM Best
Paper Award for a paper on thermal
stresses in adhesively bonded and soldered assemblies, International Society
for Hybrid Microelectronics

·        
1986
Extraordinary Contribution Award
for studies on analytical stress modeling for advanced VLSI packages, Bell
Laboratories 

 

COMMITTEES 

 Organizing
committee member, general chair/co-chair, and/or session/track chair/co-chair
for national and international meetings, conferences, and symposia, including,
but not limited to (shortened list):

·   General Chair: 

·        
IEEE CPMT ASTR
Conferences, San-Francisco, CA, September 2011; 
College Park, MD, October 2008;

·        
2009 IEEE
Conference on Portable Information Devices, Portable’09, Anchorage, AK,
September 2009;

·        
IEEE/ASME/IMAPS
Workshops on Reliability of Polymeric Materials and Plastic Packages of IC
Devices, Paris, 1998, 1999, London, 2000; 

·        
1997 International
Conference on Electronic and Photonic Packaging (Interpack-97), Hawaii, 1997.

·        
ASME Winter Annual
Meetings, Division of Electrical and Electronic Packaging, Symposia on
Structural Analysis in Electronic and Fiber-Optic Systems (1987- 2001)

·        
General Co-Chair, 

·        
IEEE Conference on
Portable Devices and Polymeric Materials for Electronic and Photonic
Applications, Garmisch-Partenkirchen, Germany, August 2008; 

·        
IEEE Conference on
Portable Information Devices, Portable’07, Orlando, Florida, March 2007; 

·        
Accelerated Stress
Testing and Reliability (ASTR) Workshop, ASTR’07, College Park, MD, October
2007

·        
Co-Chair, Track on
Thermal Phenomena in Electronic Systems, IEEE 
Vehicular Power and Propulsion Conference (VPPC),   

·        
Dearborn, MI, USA,
September 2009; 

·        
Chicago, IL, USA,
September  2011

·        
Symposium Organizer,
MRS Annual Meetings, 

·        
Symposium on
Mechanical Behavior of Microelectronic Materials and Structures (Boston,1990), 

·        
Symposium on
Reliability of Photonics Materials and Structures (San-Francisco, 1998), 

·        
Symposium on
Optical Interconnects (San Francisco, 2012)

·        
Organizing
Committee Member, 

·        
IEEE Workshop on
Reliability of Polymeric Materials and Plastic Packages of IC Devices, 

·        
POLYTRONIK’ 2001,
Potsdam, Germany;  2002, Budapest,
Hungary; 2003, Monreaux, France; 2004, Portland, OR, USA; 2005, Wroclaw, Poland

·        
THERMINIC,  European workshop on thermal phenomena in
micro- and opto-electronic (1988-present)

·        
IEEE Annual
Electronic Components and Technology Conferences, Electronic Packaging,
Interconnection, and Reliability Committees (1988-present)

·        
International
Conferences on Electronic Packaging (San Jose, CA, 1990, Binghamton, NY, 1992,
Hawaii, 1995, 1999)

·        
Session Co-Chair,
2013 IEEE Aerospace Conference, Big Sky, Montana

 

SERVICE

·        
Editor, Silicon
Valley Engineering Council  (SVEC)
Journal (2010)

·        
Technical Editor,
Springer’s book series on physics, mechanics and reliability of materials in
micro- and opto-electronic systems (started in 2006); ASME Journal of
Electronic Packaging (1994-2002)

·        
Co-founder (in
1985) and  Senior Associate Technical
Editor, ASME Journal of Electronic Packaging (1989-1994)

·        
Associate Editor,
IEEE Transactions, Components, Packaging, and Manufacturing Technology (CPMT)
(1994-present);  IEEE Transactions on
Instrumentations and Measurements (since 2012) 

·        
Member, ASME
General Awards Committee (elected in 2007); IEEE CPMTS Fellowship Committee
(elected in 2001); IEEE VTS Fellowship Committee (elected in 2011);  IEEE CPMTS Award Committee (elected in 2002);
ASME Boards on Professional Developments, and on Research and Technology
(2000-2004); Advisory Committee, ASME Press, 
Monograph/Proceedings  Series
on  "Materials, Molding, and  Computation" (1992-2002); Society of
Automotive Engineers (SAE), Committee on Fiber Optics and Avionic Engineering
(elected in 2004)

·        
Chairman, Group on
Portable Information Devices,  IEEE TAB
New Technologies Direction Committee   (
2005-2007);  IEEE VTS TC on Portable
Devices (elected in 2007)

·        
Member-at-Large,
IEEE TAB New Technology Directions Committee ( 1999-2007)

·        
Member, Chairman,
New Technology Directions Committee, IEEE, Components, Packaging, and
Manufacturing Technology (CPMT) Society (1998-2002)

·        
Member of the
Board of Governors, IEEE, Components, 
Packaging, and Manufacturing Technology Society (elected in 1996,
re-elected in 2007)

·        
Distinguished
Lecturer, IEEE CPMT Society

·        
Chairman, Honors
and Awards Committee, ASME Electrical and Electronic Packaging Division and
K-16 Committee (Heat Transfer in Microelectronics) of the Heat Transfer
Division (1991-2000)

·        
Member of the team
of experts serving AT&T, Lucent Technologies, and Bell Laboratories R&D
communities in Applied Mechanics, Applied Physics, Mechanical Behavior of
Materials, Manufacturing Engineering, Mechanical and Reliability Engineering,
and Applied Probability (1990-2001)

·        
Reviewer for NSF
proposals and numerous professional Journals (ASME Journal of Applied
Mechanics; Int. Journal of Solids and Structures; ASME Journal of Electronic
Packaging; IEEE Journal of Components, Packaging, and Manufacturing Technology;
IEEE/OSA Applied Optics; IEEE Journal of Light-wave Technology; Applied Physics
Letters; Journal of Applied Physics; Journal of Sound and Vibrations, Journal
of Thermal Stresses, and others).

 

PERSONAL DATA 

Naturalized US citizen.  Goal oriented,  highly motivated, and creative performer with
proven leadership, administrative and coaching ability, extensive project and
financial management experience, team player attitude, strong analytical and
planning skills, effective communications (both written and verbal) and
presentation skills, as well as excellent organizational, interpersonal, and
negotiation capabilities.  Possesses   thorough and in-depth understanding  of the state-of-the-art in materials,
mechanical, electrical, optical, information, telecommunication, reliability
and related areas of engineering, of new and emerging technologies, and a clear
vision for the most promising directions in the development of the applied
science.  Works exceptionally well in
dynamic and rapidly changing environments, under pressure and in short time
frames.  Works effectively across
multiple organizations, companies, and departments,  with specialists from various disciplines and
fields, and with people of different mentalities, origins, and cultural
backgrounds. Good public speaker and a quick learner. Exhibits strong interest
in, and possesses good knowledge of, foreign cultures, values, attitudes, and
customs. Always willing to learn new things and has exceptional receptiveness
to, and quick grasp of, new approaches and ideas. Has a sociable disposition and
gets along well with peers, supervisors, and subordinates.  Bi-lingual: English and Russian.  

 

PUBLICATIONS
(after arriving to the US in 1980, 
shortened  list)

 

Some recent
publications that are among top ten most often downloaded

http://asmedl.org/journals/doc/ASMEDL-home/most_downloaded.jsp?KEY=JMOEEX&Year=2010&Month=2&agg=md 

http://asmedl.org/journals/doc/ASMEDL-home/most_downloaded.jsp?KEY=AMREAD&Year=2011&Month=4&agg=md

http://tinytechip.blogspot.com/2008/12/top-ten-nanotechnology-patents-of-2008.html

http://asmedl.org/journals/doc/ASMEDL-home/most_downloaded.jsp?KEY=JAMCAV&Year=2011&Month=12&agg=md

http://asmedl.org/journals/doc/ASMEDL-home/most_downloaded.jsp?KEY=AMREAD&Year=2009&Month=7&agg=md

http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=2&f=G&l=50&co1=AND&d=PTXT&s1=suhir&s2=suhir&OS=suhir+AND+suhir&RS=suhir+AND+suhir
- h0#h0http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=2&f=G&l=50&co1=AND&d=PTXT&s1=suhir&s2=suhir&OS=suhir+AND+suhir&RS=suhir+AND+suhir
- h2#h2

 

Patents 

1.     C. Dangelo, E. Suhir, 
S. Dey, B. Wacker, Y. Xu, A. Boren, D. Olsen, Y. Zhang, P. Schwartz; B.
Padmakumar,  “Carbon nanotube-based
structures and methods for removing heat from solid-state devices”, US Patent #8,080,871, 2011

2.     E.Suhir, Y.Xu, Y.Zhang, 
“ Method and apparatus for evaluation and improvement of
mechanical and thermal properties of CNT/CNF arrays”, US Patent # 8,048,688,
2011

3.     E.Suhir, R.L.Kroeze, P. Schwartz, K.S.Ravindhran, “Composite carbon nanotube-based structures and methods for removing heat
from solid-state devices”, US Patent #8,039,961, 2011 

4.     E. Suhir, “Apparatus for Attaching a Cooling Structure
to an Integrated Circuit”, US Patent #7,477,527, 2009

5.    
D. Ingman, V.
Ogenko, E. Suhir, A. Glista, “Moisture Resistant Nano-Particle Material and Its
Applications”, US Patent #7,321,714B2, 2008

6.    
E. Suhir,
“Apparatus and Test Device for the Application and Measurement of Prescribed,
Predicted and Controlled Contact Pressure on Wires”, US Patent #7,279,916, 2007

7.    
D. Ingman and
E.Suhir, “Optical Fiber with Nano-Particle Overclad”, US Patent, #7,162,138 B2,
2007 

8.    
D. Ingman and
E.Suhir, “Optical Fiber with Nano-Particle Cladding”, US Patent, #7,162,137 B2,
2007 

9.    
E. Suhir, “Coated
Optical Glass Fiber”, US Patent #6,647,195, 2003.

10.  E.Suhir, “Optical Fiber Interconnects Having Offset
Ends with Reduced Tensile Strength and Fabrication Method”, US Patent
#6,606,434, 2003

11.  E. Suhir, “Bi-Material Assembly Adhesively Bonded at
the Ends and Fabrication Method”, US Patent #6,460, 753, 2002

12.  E. Suhir, “Strain Free Planar Optical Waveguides”, US
Patent #6,389,209, 2002

13.  E. Suhir, “Apparatus and Method for Thermostatic
Compensation of Temperature Sensitive Devices”, US Patent #6,337,932, 2002

14.  E.Suhir, “Method of Improving the Performance of
Optical Fiber, which is Interconnected Between Two Misaligned Supports”, U.S.
Patent #6,314,218, 2001

15.  E. Suhir, “Interconnected Optical Devices Having
Enhanced Reliability”, U.S. Patent #6,327,411, 2001

16.  E. Suhir, “Arrangement for Reducing Bending Stress in
an Electronics Package”, U.S. Patent #6,180,241, 2001

17.  E. Suhir, “Device and Method of Controlling the Bowing
of a Soldered or Adhesively Bonded Assembly,” US Patent #6,239,382, 2001.

18.  E. Suhir, “Method for Determining and Optimizing the
Curvature of a Glass Fiber for Reducing Fiber Stress”, US Patent #6,016,377,
2000

19.  E. Suhir, 
"Electronic Assembly Having Improved Resistance to
Delamination", U.S. Patent #6,028,772, 2000

20.  E. Suhir, “Method and Apparatus for Prooftesting
Optical Fibers”, US Patent #6,119,527, 1998

21.  E. Suhir, “Data Carriers Having an Integrated Circuit
Unit”, US Patent #5,703,350, 1997

22.  E. Suhir and J. Weld, “Electronic Package with Reduced
Bending Stress”, US Patent #5,627,407, 1997.

 

Books

23.  E. Suhir, “Some Basic Mechanics-of-Materials Problems
in Electronics and Photonics”, Springer, in preparation

24.  E. Suhir, “Optical Fiber Interconnect: Physical design
for Reliability”, SPIE Press, in preparation

25.  E. Suhir, “Basics of Electronics Reliability”,
Springer, in print

26.  E’ Suhir, D. Steinberg, T. Yi, eds.,“Dynamic Response
of Electronic and Photonic Systems to Shocks and Vibrations”, John Wiley, 2011

27.  X. Fan, E. Suhir, “Moisture Sensitive Plastic Packages
of IC Devices”, Springer, 2010

28.  E. Suhir, CP Wong, YC Lee, eds. “Micro- and
Opto-Electronic Materials and Structures: Physics, Mechanics, Design,
Packaging, Reliability”, 2 volumes, Springer, 2008

29.  A. Driessen, R. G. Baets, J. G. McInerney,
and E. Suhir, “Laser Diodes, Optoelectronic Devices, and Heterogeneous Integration”,
(SPIE),  2003

30.  E. Suhir, M. Fukuda, C. R. Kurkjian, eds., “Reliability
of Photonic Materials and Structures”, Materials Research Society Symposia
Proceedings, vol. 531, 1998.

31.  E. Suhir, ed., “Structural Analysis in
Microelectronics and Fiber Optics”, ASME Press, 1997 

32.  E. Suhir, “Applied Probability for Engineers and
Scientists”, McGraw Hill, New York, 1997.

33.    
E.
Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME
Press, 1996 

34.    
E.
Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME
Press, 1995 

35.     M. Schen, H. Abe, and E. Suhir, eds. “Thermal and
Mechanical Behavior and Modeling”, ASME, AMD-Vol,1994

36.    
E. Suhir,
“Structural Analysis in Microelectronic and Fiber Optic Systems”, vol.1, Basic
Principles of Engineering Elasticity and Fundamentals of Structural Analysis”,
Van Nostrand Reinhold, New York, 1991.

37.     E. Suhir, R.C.Cammarata, D.D.L.Chung, M.Jono,
“Mechanical Behavior of Materials and Structures in Microelectronics”,
Materials Research Society Symposia Proceedings, vol.226, 1991.

38.    
E. Suhir, P.
McSharry, “Soviet Naval Architecture: Theory and Applications of Hydrodynamics
(Trans from Russian)”, 1986

39.    
E. Suhir, Y.
Raskin, A. Tunik, “Russian strength standards for commercial ships”, American Bureau of Shipping, 1982  

 

Book Chapters 

2011

40.    
E.Suhir, “Linear
Response to Shocks and Vibrations”,  in
E.Suhir, D.Steinberg and T.Yu, “Structural Dynamics of Electronic and Photonic
Systems”, John Wiley, Hoboken, NJ., 2011

41.    
E.Suhir, “Linear
and Nonlinear Vibrations Caused by Periodic Impulses”. in E.Suhir, D.Steinberg
and T.Yu, “Structural Dynamics of Electronic and Photonic Systems”, John Wiley,
Hoboken, NJ., 2011

42.    
E.Suhir, “Random
Vibrations of Structural Elements in Electronic and Photonic Systems”, in
E.Suhir, D.Steinberg and T.Yu, “Structural Dynamics of Electronic and Photonic
Systems”, John Wiley, Hoboken, NJ., 2011

43.    
C.Y.Zhou, T.X.Yu,
S.W.Ricky Lee and E.Suhir, “Shock Test Methods and Test Standards for Portable
Electronic Devices”, in E.Suhir, D.Steinberg and T.Yu, “Structural Dynamics of
Electronic and Photonic Systems”, John Wiley, Hoboken, NJ., 2011

44.    
E. Suhir, “Shock
Protection of Portable Electronic Devices Using a “Cushion” of an Array of
Wires (AOW)”, in E.Suhir, D.Steinberg and T.Yu, “Structural Dynamics of
Electronic and Photonic Systems”, John Wiley, Hoboken, NJ., 2011

45.    
M.Vujosevic and
E.Suhir, “Dynamic Response of PCB Structures to Shock Loading in Reliability
Tests”, in E.Suhir, D.Steinberg and T.Yu, “Structural Dynamics of Electronic
and Photonic Systems”, John Wiley, Hoboken, NJ., 2011

46.    
E.Suhir, “Linear
Response of a Single-Degree-of-Freedom System to an Impact Load: Could Shock
Tests Adequately Mimic Drop Test Conditions?”, in E.Suhir, D.Steinberg and
T.Yu, “Structural Dynamics of Electronic and Photonic Systems”, John Wiley,
Hoboken, NJ., 2011

47.    
E.Suhir and
L.Arruda, “Could an Impact Load of Finite Duration Be Substituted with an
Instantaneous Impulse”? in E.Suhir, D.Steinberg and T.Yu, “Structural Dynamics
of Electronic and Photonic Systems”, John Wiley, Hoboken, NJ., 2011

 

2007-2009

48.     E. Suhir, “”Stretchable” Electronics: Predicted
Thermo-Mechanical Stresses in the Die”, 
Fraunhofer  Institute, Volume
Dedicated to the 60-th Birthday of Prof. B. Michel, Berlin, Germany, 2009

49.     Y.Zhang, E.Suhir, C.Gu, “Physical properties and
mechanical behavior of  carbon nano-tubes
(CNTs) and carbon nano-fibers  (CNFs) as
thermal interface materials (TIMs) for high power integrated circuit (IC)
packages: review and extension, in C.P.Wong et al, eds, “Nano-Bio-Electronic,
Photonic and MEMS Packaging”, Springer, 2009

50.    
E. Suhir,
“Fiber-Optics Structural Mechanics and Nano-Technology Based New Generation of
Fiber Coatings: Review and Extension”, in E. Suhir, CP Wong, YC Lee, eds.
“Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics,
Design, Packaging, Reliability”, Springer, 2007

51.    
E. Suhir, “Dynamic
Response of Micro-Electronic Systems to Shocks and Vibrations: Review and
Extension”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic
Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”,
Springer, 2007

52.    
V. Birman and E.
Suhir, “Effect of Material’s Nonlinearity on the Mechanical Response of Some
Piezo-Electric and Photonic Systems”, in E. Suhir, CP Wong, YC Lee, eds.
“Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics,
Design, Packaging, Reliability”, Springer, 2007

53.    
E. Suhir,
“Analytical Thermal Stress Modeling in Physical Design for Reliability of
Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results”, in
E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and
Structures: Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007

54.    
E. Suhir, “How to
Make a Device into a Product: Accelerated Life Testing It’s Role, Attributes,
Challenges, Pirfalls, and Interaction with Qualification Testing”, in E. Suhir,
CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures:
Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007

55.    
E. Suhir, D.
Ingman, “Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic
Applications”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic
Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”,
Springer, 2007

 

1988-1999

56.     E. Suhir, “Effect of Plastic Package Geometry on its
Propensity to Moisture Induced Failure”, in R.Tummala, M.Kosec, W. Kinzy Jones
and D. Belavic, eds., “Electronic Packaging for High Reliability: Low Cost
Electronics”, NATO ASI Series, 3. “High Technology”, vol.57, Kluwer Academic
Publishers, 1999.

57.     E. Suhir, “Structural Analysis in Fiber Optics”, in J.
Menon, ed., “Trends in Lightwave Technology”, Council of Scientific
Information, India, 1995.

58.     E. Suhir, “Predicted Bow of Plastic Packages of
Integrated Circuit Devices”, in J. H. Lau, ed., Thermal Stress and Strain in
Microelectronic Packaging”, Van Nostrand Reinhold, New York, 1993.

59.     E. Suhir and Y.C. Lee, “Thermal, Mechanical and
Environmental Durability Design Methodologies in Electronic Packaging”, in
“Handbook of Electronic Materials”, ASM International, 1990.

60.     E. Suhir, “Thermal Stress Failures in Microelectronic
Components - Review and Extension”, in A. Bar-Cohen and A. D. Kraus, eds.,
“Advances in Thermal Modeling of Electronic Components and Systems”,
Hemisphere, New York, 1988.

Papers

2013

61.     E.Suhir and K. Tapero, “Probabilistic Design for
Reliability (PDfR) of Spacecraft Electronics Subjected to Ionizing
Radiation(IR)” . in preparation

62.     E.Suhir, “Microelectronics Reliability:
State-of-the-Art, Challenges, New Frontiers’”, in preparation

63.     E.Suhir, “Analysis of a Finite Circular Cylinder, with
Application to Experimental Evaluation of Elastic Constants”, in preparation

64.     J.-M. Salotti and E. Suhir, “About Criteria to Consider
for Low-Risk Manned Missions to Mars”,  Acta Astronautica,  in review

65.     E. Suhir, C. Bey, 
S. Lini, B. Claverie, “Anticipation in Aeronautics: Probabilistic
Assessments”, IJHFMS, in review

66.     E.Suhir, S.Kang, J. Nicolics, C. Gu, A.Bensoussan,
L.Bechou, “Analytical Stress Model for the Evaluation of Thermal Stresses in a
Cylindrical Tri-Material Body with Application to Optical Fibers”, Journal of
Electrical and Control Engineering, accepted

67.     E. Suhir,
“Saint-Venant Principle and the Minimum Length of a Dual-Coated Optical Fiber
Specimen in Reliability (Proof) Testing”, 2013 ESREF, Arcachon, France,
accepted 

68.     E. Suhir, L. Bechou, A.Bensoussan, J. Nicolics
“Photovoltaic Reliability Engineering: Qualification Testing (QT) and
Probabilistic Design-for-Reliability (PDfR) Concept”,  invited presentation, 2013 SPIE PV
Reliability Conference, August 2013, San Diego CA 

69.     E.Suhir, “Could Electronics Reliability Be Predicted,
Quantified and Assured?” Microelectronics Reliability,  in press

70.     E. Suhir, “Failure-Oriented-Accelerated-Testing (FOAT)
and Its Role in Making a Viable IC Package into a Reliable Product”,  Circuits Assembly, June 2013

71.     E. Suhir, “Boltzmann-Arrhenius-Zhurkov (BAZ) Model in
Physics-of-Materials Problems”, Modern Physics Letters B (MPLB), vol.27, April
2013

72.     E.Suhir, “Structural Dynamics of Electronics Systems”,
Modern Physics Letters B (MPLB), Vol. 27, No. 7, 20 March 2013

73.     W. Benhadjala, I. Bord-Majek,
L. Béchou, E. Suhir, M. Buet, F. Rougé, V. Gaud. and Y. Ousten,
“Effect of Processing Factors on Dielectric Properties  of BaTiO3/Hyperbranched Polyester
Core-Shell Nano-Particles”, ECTC,  San
Diego, May 2013

74.     E. Suhir, “Thermal Stress Failures in Electronics and
Photonics: Physics, Modeling. Prevention”, Journal of Thermal Stresses, June 3,
2013

75.     E. Suhir, ”“Miracle-on-the-Hudson”: Quantified
Aftermath”, Int. J. Human Factors Modeling and Simulation, April 2013

76.     A. Bensoussan and E. Suhir, “Design-for-Reliability
(DfR) of Aerospace Electronics: Attributes and Challenges",  2013 IEEE Aerospace Conference, Big Sky,
Montana, March 2013

77.     E. Suhir, “Assuring Aerospace Electronics and Photonics
Reliability: What Could and Should Be Done Differently”, 2013 IEEE Aerospace
Conference, Big Sky, Montana, March 2013

78.     E. Suhir, “Predicted Reliability of Aerospace
Electronics: Application of Two Advanced Probabilistic Techniques”, 2013 IEEE
Aerospace Conference, Big Sky, Montana, March 2013

79.     E. Suhir, L .Bechou, B. Levrier, D. Calvez, “Assessment
of the Size of the Inelastic Zone in a BGA Assembly”, 2013 IEEE Aerospace
Conference, Big Sky, Montana, March 2013

80.     E. Suhir and 
A.Shakouri, “Predicted Thermal Stresses in a Multi-Leg Thermoelectric
Module (TEM) Design”, ASME J. Appl. Mech., vol. 80, March 2013

81.     E. Suhir, 
D.Shangguan, L. Bechou, “Predicted Thermal Stresses in a Tri-Material
Assembly with Application to Silicon-Based Photovoltaic Module ”, ASME J. Appl. Mech., vol.80, March 2013

82.     E. Suhir, L.Bechou, B. Levrier, “Predicted Size of an
Inelastic Zone in a Ball-Grid-Array Assembly”, ASME J. Appl. Mech., vol. 80, March
2013 

83.     E. Suhir, L. Bechou, “Availability Index and Minimized
Reliability Cost”, Circuit Assemblies, February 2013 

84.     E. Suhir, “Elastic Stability of a Dual-Coated Fiber”,
SPIE Paper #8621-37, Photonics West, February 2013

85.     E. Suhir, “Lattice-Misfit Stresses in a Circular
Bi-Material Gallium-Nitride Assembly”, ASME J. Appl. Mech., vol.80, January
2013

 

2012

86.     E.Suhir, L. Bechou, A.Bensoussan, “Technical
Diagnostics in Electronics: Application of Bayes Formula and
Boltzmann-Arrhenius-Zhurkov (BAZ) Model”, Circuit Assembly, December 3,  2012

87.     W. Benhadjala, I. Bord-Majek, L. Bechou, E. Suhir,
M.Buet, F. Rougé, V. Gaud, B. Plano, Y. Ousten, "Improved Performances of
Polymer-Based Dielectric by Using Inorganic/Organic  Core-Shell Nanoparticles", Appl. Phys.
Lett., 101, 142901, October 2012.

88.     E. Suhir, A. Shakouri, “Assembly Bonded at the Ends:  Could Thinner and Longer Legs Result in a
Lower Thermal Stress in a Thermoelectric Module (TEM) Design?”, ASME Journal of
Applied Mechanics, vol.79, No.6, 2012 

89.     E.Suhir, “When
Reliability is Imperative, Ability to Quantify It is a Must”, IMAPS Advanced
Microelectronics, August 2012

90.     E.Suhir, “Thermal Stress in Electronics and Photonics:
Prediction and Prevention”, Keynote presentation, Therminic, Budapest,
September, 2012

91.     E.Suhir, “Dynamic Response of Electronic Systems to
Shocks and Vibrations: Application of Analytical (Mathematical) Modeling”, 2012
DYMAT Conference

92.     E.Suhir, “Electronic Product Qual Specs Should Consider
Its Most Likely Application(s)”, ChipScale Reviews, November 2012

93.     E.Suhir, D.Shangguan, L.Bechou, “Predicted Thermal
Stresses in a Photovoltaic  Module
(PVM)”, PV International (UK),  Second
Quarter, May 2012 

94.     E. Suhir, R. Mahajan, A. Lucero, L. Bechou,
“Probabilistic Design for Reliability (PDfR) and a Novel Approach to
Qualification Testing (QT)”, 2012 IEEE/AIAA Aerospace Conf., Big Sky, Montana,
2012

95.     B. Nagl, E.Suhir, W. Gschohsmann, J.Nicolics,
“Transient Thermo-Mechanical Study of a Thick-Wire Bond with Particular
Attention to the Interfacial Shearing Stress”, 
Int. Spring Seminar on Electronics Technology (ISSE), 09-13, Bad Aussee, Austria, May 2012

96.     W. Benhadjala, I. Bord, 
L. Béchou, E. Suhir,  M. Buet, F.
Rougé,  Y. Ousten,  “Novel Core-Shell Nanocomposite for RF
Embedded Capacitors:  Processing and
Characterization”,  2012 ECTC , June 2012

97.     E.Suhir, J.Nicolics, “Bending of a Bi-Material
Cantilever Beam, with Consideration of the Role of the Interfacial Shearing
Stress”, ZAMM, 2012, published-on-line 

98.     E. Suhir, “Likelihood of Vehicular
Mission-Success-and-Safety”, Journal of Aircraft, vol.49, No.1, 2012

 

2011

99.     E. Suhir, “Remaining Useful Lifetime (RUL): Probabilistic
Predictive Model”, International Journal of PHM, vol 2(2), 2011 

100.  E. Suhir, W.Gschohsmann, J. Nicolics, “Analysis of a
Bi-Material Strip”, Z. Angew. Math. Mech., 1 – 9
(2011) 

101.  E.Suhir, “Stresses in Bi-Material GaN Assemblies”,
Journal of Applied Physics, 110, published on line, 2011

102.  E.Suhir, “Predicted Response of the Die-Carrier
Assembly to the Combined Action of Tension and Bending Applied to the Carrier
in Flexible Electronics”, ASME J. Appl. Mech., vol. 79, No.1, 2011

103.  E.Suhir, C.Gu, L.Cao, “Predicted Thermal Stress in a
Circular Adhesively Bonded Assembly with Identical Adherends”, ASME J. Appl.
Mech, vol. 79, No.1, 2011

104.  E.Suhir, "Human-in-the-Loop”: Likelihood of a
Vehicular Mission-Success-and-Safety, and the Role of the Human Factor”, Paper
ID 1168, 2011 IEEE/AIAA Aerospace Conference, Big Sky, Montana, March 5-12,
2011;

105.  E. Suhir, “Elastic Stability of a Rod Supported By an
Elastic Foundation, with Application to Nano-Composites”, ASME J. Appl. Mech,
vol. 79, No.1, 2011

106.  W. Gschohsmann, J.Nicolics, E.Suhir, “Deformations in
Stretched Surface Mounted Ceramic Strips for Sensor Applications”,
Microelectronics International, vol.28, Issue 3, 2011

107.  E.Suhir, “Thermal Stress Failures: Predictive Modeling
Explains the Reliability Physics Behind Them”, IMAPS Advanced Microelectronics,
vol.38, No.4, July/August 2011

108.  E.Suhir, “Predictive Modeling is a Powerful Means to
Prevent Thermal Stress Failures in Electronics and Photonics”, ChipScale
Reviews, vol.15, No.4, July-August 2011

109.  E.Suhir, R.Mahajan, “Are Current Qualification
Practices Adequate?“, Circuit Assembly, April 2011

110.  E.Suhir, “Predictive Modeling of the Dynamic Response
of Electronic Systems to Shocks and Vibrations”, ASME Applied Mechanics
Reviews, vol. 63, No.5, March, 2011

111.  E. Suhir, “Analysis of a Pre-Stressed Bi-Material
Accelerated Life Test (ALT) Specimen”, Zeitschrift fur Angewandte Mathematik
und Mechanik (ZAMM), vol.91, No.5, 2011

112.  E. Suhir and R. H. Mogford, “"Two Men in a
Cockpit": Probabilistic Assessment of the Likelihood of a Casualty if One
of the Two Navigators Becomes Incapacitated”, Journal of Aircraft, vol.48,
No.4, July-August 2011

 

2010

113.  E. Suhir, “Probabilistic Design for Reliability””,
ChipScale Reviews, vol.14, No.6, 2010 

114.  W.
Gschohsmann, J. Nicolics,  E. Suhir, “Elastizitätsmodell eines keramischen
Sensorstreifens bei longitudinaler Verformung”,  Elektrotechnik und Informationstechnik, Vol.
127, No.10, October 2010 

115.  E.Suhir, “Probabilistic Modeling of the Role of the
Human Factor in the Helicopter-Landing-Ship (HLS) Situation”, Int. J. Human
Factor Modeling and Simulation (IJHFMS), vol.1, Issue 3, 2010, see also

         http://www.inderscience.com/browse/index.php?journalID=124&action=coming

116.  E. Suhir, W.Gschohsmann, J. Nicolics, “Analysis of an Elongated
Stretched Strip, With Application to a Strain-Gage Electrical Sensor
Structure’, Zeitschrift fur Angewandte
Mathematik und Mechanik (ZAMM), No.10, 2010

117.  E.Suhir, “Predicted Stresses in Die-Carrier Assemblies
in “Stretchable” Electronics: Is There an Incentive for Using a Compliant
Bond?”,  Zeitschrift fur Angewandte
Mathematik und Mechanik (ZAMM), No.10, 2010

118.     
E. Suhir and
L.Arruda, “Could an Impact Load of Finite Duration Acting on a Duffing
Oscillator Be Substituted with an Instantaneous Impulse?”, JSME Journal of Solid Mechanics and Materials
Engineering (JSMME), vol.4, No.9, 2010 

119.     
E.Suhir and
T. Reinikainen, “Interfacial Stresses in a Lap Shear Joint (LSJ): The
“Transverse Groove Effect” (TGE)”, JSME Journal of Solid Mechanics and Materials Engineering (JSMME),
vol.4, No.8, 2010  

120.  E.Suhir and M.Vujosevic, “Bi-Material Assembly
Subjected to Tensile Forces and Bending Moments Applied to the Ends of One of
Its Components”, JSME Journal of Solid Mechanic and Materials Engineering
(JSMME), vol.4, No.4, 2010 

121.  E. Suhir, “Optical Fiber Interconnects: Design for
Reliability”, Society of Optical Engineers (SPIE), Proc. of SPIE, Vol. 7607 760717-8, 2010

 

2009

122.  E. Suhir and L. Arruda, “The Coordinate Function in the
Problem of the Nonlinear Dynamic Response of an Elongated Printed Circuit Board
(PCB) to a Drop Impact Applied to Its Support Contour”, European Journal of
Applied Physics, vol.48, No.2, 2009 

123.  C.Y.Zhou, T.X.Yu, E.Suhir,  “Design of Shock Table Tests to Mimic
Real-Life Drop Conditions”, IEEE CPMT Transactions, vol.32, No.4, 2009

124.  Biswas, I.S. Bayer, A. Tripathi, E.H.Lock, S.G. Walton,
M.G. Norton, D.K. Avasthi, D.H.Dahanayaka, L.A.Bumm, E.Suhir, A.R. Chowdhury,
R. Gupta, “Fabrication of nanoelectric BaTiO Composites Exhibiting
stable Capacitor Functions in the High frequency (≥100MHz) Through Interfacial
Polarization Interactions”, Nanoscience and Nanotechnology Letters, vol.1, 1-8,
2009

125.  Biswas, I.S. Bayer, D.H. Dahanayaka, L.A. Bumm, Z. Li,
F. Watanabe, R. Sharma, Y. Xu, A.S. Biris, M.G. Norton, E. Suhir, “Tailored
Polymer-Metal Fractal Nanocomposites: An Approach to highly Active SERS
Substrates”, Nanotechnology, 20, 2009

126.  E.Suhir, “On a Paradoxical Situation Related to Bonded
Joints: Could Stiffer Mid-Portions of a Compliant Attachment Result in Lower
Thermal Stress?”, JASME Journal of Solid Mechanics and Materials Engineering”,
vol.3, No.7, 2009

127.  E. Suhir, “Stretchable Electronics: Does One Need a
Good Thermal Expansion Match Between the Si Die and the Plastic Carrier?” ,
IEEE ECTC 2009 

128.  T. Reinikainen and E.Suhir, “Novel Shear Test
Methodology for the Most Accurate Assessment of Solder Material Properties”,
IEEE ECTC 2009 

129.  E. Suhir, “Lateral Compliance and Elastic Stability of
a Dual-Coated Optical Fiber of Finite Length, with Application to Nano-Rods
Embedded in Low-Modulus Elastic Media”, IEEE ECTC 2009  

130.  E.Suhir, “Helicopter-Landing-Ship: Undercarriage
Strength and the Role of the Human Factor”, ASME OMAE Conference, June 1-9,
Honolulu, Hawaii, 2009; see also ASME OMAE Journal, Febr. 2010 

131.  E. Suhir, “Probabilistic Modeling of the Role of the
Human Factor in the Helicopter Landing Ship (HLS) Situation”, International
Journal of Human Factor Modeling and Simulation,  2009

132.  E.Suhir, “Analytical Thermal Stress  Modeling in Electronic and Photonic Systems”,
ASME Applied Mechanics Reviews, invited paper, vol.62, No.4, 2009.

133.  E.Suhir and T. Reinikainen, “Interfacial  Stresess and a  Lap Shear Joint (LSJ): The “Transverse Groove
Effect” (TGE)”, Japan Society of Mechanical Engineers, Journal of Solid
Mechanics and Materials Engineering, JSMME, vol.3, No.6, 2009

134.  E.Suhir,  M.
Vujosevic, and T. Reinikainen,  “Nonlinear
Dynamic Response of a “Flexible-and-Heavy” Printed Circuit Board (PCB) to an
Impact Load Applied to Its Support Contour”, Journal of Applied Physics, D, 42,
No.4, 2009

135.  E. Suhir, “Thermal Stress in a Bi-Material Assembly
with a “Piecewise-Continuous” Bonding Layer: Theorem of Three Axial Forces”,
Journal of Applied Physics, D, 42, 2009 

 

2008

136.  E.Suhir and M. Vujosevic, “Interfacial Stresses in a
Bi-material Assembly with a Compliant Bonding Layer”, Journal of Applied
Physics D, vol.41, 2008

137.  E.Suhir and T. Reinikainen, “On a Paradoxical Situation
Related to Lap Shear Joints: Could Transverse Grooves in the Adherends Lead to
Lower Interfacial Stresses?”, Journal of Applied Physics D, vol.41, 2008

138.  E. Suhir, “Lateral Compliance of a Compressed
Cantilever Beam, with Application to Micro-Electronic and Fiber-Optic
Structures”, Journal of Applied Physics D, vol.41,No.1,  2008

139.  I.S.Bayer, A.Biswas, J.B.Szczech, E.Suhir, M.G.Norton,
“Radio Frequency Functional Capacitors Made of All-Organic Composites of
Thiourea in Field-Responsive Polymers for Embedded Applications”, Applied
Physics Letters, vol. 92, No.1, 2008.

 

2007

140.  T. Mirer, D. Ingman, E. Suhir, “Reliability Improvement
Through Nano-Particle-Material-Based Fiber Structures”, Optical Fiber
Technology, v. 13, 2007,pp.27-31.

141.  E. Suhir, “Elastic Stability of a Dual-Coated Optical
Fiber of Finite Length”, Journal of Applied Physics, vol.102, No.5, 2007

142.  E. Suhir, “Elastic Stability of a Dual-Coated Optical
Fiber with a Stripped Off Coating at Its End”, Journal of Applied Physics, vol.
102, No.4, 2007

143.  E. Suhir, “Response of a Heavy Electronic Component to
Harmonic Excitations Applied to Its External Electric Leads”, Elektrotechnik
& Informationstechnik (Austria), vol.9, 2007

144.  E, Suhir, “Dynamic Response of Micro-Electronic
Structural Elements to Shocks and Vibrations”, Keynote presentation,
MicroNanoReliability Congress, Berlin-Koepenick, September 2-5, 2007

145.  E. Suhir, “Polymer Coating of Optical Silica Fibers,
and a Nanomaterial-Based Coating System”, Keynote Presentation,  Polytronic’2007, Proceedings of the
International Conference on Polymeric Materials for Micro- and Opto-Electronics
Applications, Tokyo, Japan, January 14-16, 2007

 

2006

146.  E.Suhir, “Interfacial Thermal Stresses in a Bi-Material
Assembly with a Low-Yield-Stress Bonding Layer”, Modeling and Simulation in
Materials Science and Engineering, vol. 14, 2006 

147.  Yuan Xu, Yi Zhang, Ephraim Suhir, and Xinwei Wang, ”
Thermal Properties of Carbon Nanotube Array for Integrated Circuits Cooling”
Journal of Applied Physics,100, 074302, 2006

148.  Yi Zhang, Yuan Xu and Ephraim Suhir,  “Effect of Rapid Thermal Annealing (RTA) on
Thermal Properties of Carbon Nanofibre (CNF) Arrays”, Journal of Physics D:
Applied Physics ,39, 2006 

149.  Yi Zhang, Yuan Xu and Ephraim Suhir,  “Effective Young’s Modulus of Carbon
Nano-Fiber Array”,  Journal of Materials
Research,vol.21, No.11, Nov. 2006

150.  Yi Zhang, Ephraim Suhir, Yuan Xu, and Claire Gu, “
Bonding Strength of Carbon Nanofiber Array to its Substrate”,  Journal of Materials Research,vol. 21, No.11,
Nov.2006

151.  Yi. Zhang, Yuan Xu, Claire Gu and Ephraim Suhir,
“Predicted Shear-off Stress in Bonded Assemblies: Review and Extension” ASTR
2006, San Francisco, CA, 2006

152.  E. Suhir, “Fiber Optics Structural Mechanics, and a New
Generation of Nano-Technology Based Optical Fiber Cladding and Coating”,
Invited talk at the Photonics West Conf., and SPIE Publication, 2006

153.  E. Suhir, D. Ingman, “Highly Compliant Bonding Material
and Structure for Micro- and Opto-Electronic Applications”, ECTC’06
Proceedings, San Diego, May 2006

 

2005

154.  E.Suhir, “Reliability and Accelerated Life Testing”,
Semiconductor International, February 1, 2005.

155.  E.Suhir, “Analytical Thermal Stress Modeling in
Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role,
Attributes, Challenges, Results”, Invited Talk, Therminic, 2005, Lago Maggiore,
Italy, September 27-30, 2005

156.  E.Suhir, “Mechanics of Coated Optical Fibers: Review
and Extension”, ECTC’2005, Orlando, Florida, 2005

157.  E. Suhir, “Microelectronic and Photonic Systems: Role
of Structural Analysis”, InterPack’2005, San Francisco, July 2005 

158.  E. Suhir, “New Nano-Particle Material (NPM) for Micro-
and Opto-Electronic Packaging Applications”, IEEE Workshop on Advanced
Packaging Materials, Irvine, March 2005.

159.  E.Suhir, “Inventive Leadership: Could a Good Engineer
Become a Good Entrepreneur?”, ASME Mechanical Engineering Magazine, November
2005

 

2004

160.  E. Suhir, “Bow-Free Assemblies: Predicted Stresses”,
Therminic’2004, Niece, France, Sept. 29-Oct.1, 2004

161.  E. Suhir, “Polymer Coated Optical Glass Fiber
Reliability: Could Nano-Technology Make a Difference?”, Polytronic’04,
Portland, OR, September 13-15, 2004

162.  E. Suhir, “Crossing the Lines, or Should We Just Mind
Our Own Business?”, Feature Article, Mechanical Engineering, 2004

 

2003

163.  E. Suhir, “Thermal Stress in an Adhesively Bonded Joint
with a Low Modulus Adhesive Layer at the Ends”, 
Journal  of Applied Physics, April
2003.

164.  E. Suhir, “Thermal Stress Modeling in Micro- and
Opto-Electronics: Review and Extension”, Invited Presentation, ASME Symposium
Dedicated to Dr. Richard Chu, IBM, Washington, DC, November 2003

165.  E. Suhir, “Polymer Coated Optical Glass Fibers: Review
and Extension”, Proceedings of the POLYTRONIK’2003, Montreaux, October 21-24,
2003.

166.  E. Suhir, “Modeling of Thermal Stress in
Microelectronic and Photonic Structures: Role, Attributes, Challenges and Brief
Review”, Special Issue, ASME Journal of Electronic Packaging, vol.125, No.2,
June 2003.

167.  E. Suhir, V.Ogenko, D. Ingman, “Two-Point Bending of
Coated Optical Fibers”, Proceedings of the PhoMat’2003 Conference,
San-Francisco, CA, August 2003

168.  E. Suhir, “How to Make a Photonic Device Into a
Product: Role of Accelerated Life Testing”, Keynote Address at the
International Conference of Business Aspects of Microelectronic Industry, Hong-Kong,
January 2003.

169.  E. Suhir, “Bow Free Adhesively Bonded Assemblies:
Predicted Stresses”, Electrotechnik & Informationtechnik, 120 (6), June
2003.

 

2002

170.  E. Suhir, “Analytical Stress-Strain Modeling in
Photonics Engineering: Its Role, Attributes and Interaction with the
Finite-Element Method”, Laser Focus World, May 2002.

171.  E. Suhir, Accelerated Life Testing (ALT) in
Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls,
and Interaction With Qualification Tests, Journal of Electronic Packaging
-- September 2002 -- Volume 124, Issue 3, pp. 281-291 

172.  E.Suhir, “Could Shock Tests Adequately Mimic Drop Test
Conditions?”, IEEE ECTC Conference Proceedings, San-Diego, CA, May 28-31, 2002

 

2001

173.  E. Suhir, “Thermal Stress in a Polymer Coated Optical
Glass Fiber with a Low Modulus Coating at the Ends”, Journal of Materials
Research, vol. 16,  No. 10,   2001

174.  E. Suhir, “Thermomechanical Stress Modeling in
Microelectronics and Photonics”, Electronic Cooling, vol.7, No.4, 2001

175.  M. Ushitsky, E. Suhir, G.W. Kammlott, “Thermoelastic
Behavior of Filled Molding Compounds: Composite Mechanics Approach”, ASME
Journal of Electronic Packaging, vol.123, No.4, 2001

176.  E. Suhir, “Adequate Underkeel Clearance (UKC) for a
Ship Passing a Shallow Waterway: Application of the Extreme Value Distribution
(EVD)”, Proceedings of OMAE2001 Conference, Paper OMAE2001/S&R-2113, Rio de
Janeiro, Brazil, 2001

177.  E. Suhir, "Analysis of Interfacial Thermal
Stresses in a Tri-Material Assembly", Journal of Applied Physics, vol.89,
No.7, 2001

178.  E. Suhir, “Thermal Stress in a Bi-Material Assembly
Adhesively Bonded at the Ends”, Journal of Applied Physics, vol. 89, No.1,
2001.

179.  M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy
Molding Compounds Filled with Particles", ASME Journal of Electronic
Packaging, vol.123, No.1, 2001.

 

2000

180.  A. Katz, M. Pecht, E. Suhir, “Accelerated Testing in
Microelectronics: Review, Pitfalls and New Developments”, Proceedings of the
International Symposium on Microelectronics and Packaging, IMAPS, Israel, 2000

181.  E. Suhir, “Microelectronics and Photonics – the
Future”, Microelectronics Journal, vol.31, No.11-12, 2000

182.  E. Suhir, and J.J. Vuillamin, Jr, "Effects of the
CTE and Young's Modulus Lateral Gradients on the Bowing of an Optical Fiber:
Analytical and Finite Element Modeling", Optical Engineering, vol. 39, No.
12, 2000

183.  E. Suhir, “Predicted Fundamental Vibration Frequency of
a Heavy Electronic Component Mounted on a Printed Circuit Board”, ASME Journal
of Electronic Packaging, vol.122, No.1, 2000

184.  E.Suhir, “Modeling of the Mechanical Behavior of
Materials in “High-Tech” Systems: Attributes and Review”, ASME Journal of
Electronic Packaging, vol.121, No.3, 2000

185.  E. Suhir, “Thermal Stress Modeling in Microelectronics
and Photonics Packaging, and the Application of the Probabilistic Approach:
Review and Extension”, IMAPS International Journal of Microcircuits and
Electronic Packaging, vol.23, No.2, 2000 (invited paper)

186.  E. Suhir, “Predicted Stresses in a Circular
Substrate/Thin-Film System Subjected to the Change in Temperature”,  Journal of Applied Physics, vol.88, No.5,
2000

187.  E.Suhir, “The Future of Microelectronics and Photonics,
and the Role of Mechanical, Materials and Reliability Engineering”, Proceedings
of the International Conference on Materials in Microelectronics, MicroMat
2000, April 17-19, 2000, Berlin, Germany

188.  E.Suhir, “Silica Optical Fiber Interconnects: Design
for Reliability”, Proceedings of the Annual Conference of the American Ceramic
Society, St.-Louis, MO, May 3, 2000

189.  E.Suhir, “Optical Fiber Interconnect with the Ends
Offset and Axial Loading: What Could Be Done to Reduce the Tensile Stress in
the Fiber”?, Journal of Applied Physics, vol.88, No.7, 2000

190.  E. Suhir, “Adhesively Bonded Assemblies with Identical
Nondeformable Adherends and “Piecewise Continuous” Adhesive Layer: Predicted
Thermal Stresses and Displacements in the Adhesive”, Int. Journal of Solids and
Structures, vol.37, 2000

 

1999

191.  E. Suhir, “Thermal Stress Failures in Microelectronics
and Photonics: Prediction and Prevention”, Future Circuits International, issue
5, 1999

192.  E. Suhir, “Adhesively 
Bonded Assemblies with Identical Nondeformable Adherends: Predicted
Thermal Stresses in the Adhesive Layer”, Composite Interfaces, vol.6, No.2,
1999

193.  E. Suhir, “Optimized Configuration of an Optical fiber “Pigtail”
Bent on a Cylindrical Surface”, in T. Winkler and A, Schubert, eds., “Materials
Mechanics, Fracture Mechanics, Micromechanics”, An Anniversary Volume in Honor
of B. Michel’s 50th Birthday, Fraunhofer IZM, Berlin, 1999

194.  E.Suhir, “Elastic Stability of the Glass Fibers in a
Micromachined Fiber-Optic Switch Packaged into a Dual-in-Line Ceramic Package”,
ECTC, 1999

 

1998

195.  E. Suhir, “Coated Optical Fiber Interconnect Subjected
to the Ends Off-Set and Axial Loading”, International Workshop on Reliability of
Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2,
1998, ASME Press, 1998.

196.  E. Suhir, “Critical Strain and Postbuckling Stress in
Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using
Thicker Coating?”, International Workshop on Reliability of Polymeric Materials
and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2, 1998, ASME Press,
1998.

197.  E. Suhir, “Adhesively Bonded Assemblies with Identical
Nondeformable Adherends and Inhomogeneous 
Adhesive Layer: Predicted Thermal Stresses in the Adhesive”, Journal of
Reinforced Plastics and Composites, vol.17, No.14, 1998

198.  E. Suhir, 
“Bending Stress in an Optical Fiber Interconnect Experiencing
Significant Ends Off-Set”, MRS Symposia Proceedings, vol. 531, 1998.

199.  E. Suhir, “Optical Fiber Interconnect Subjected to a
Not-Very-Small Ends Off-Set: Effect of the Reactive Tension”, MRS Symposia
Proceedings, vol. 531, 1998.

200.  E. Suhir, “Fiber Optic Structural Mechanics – Brief
Review”, Editor’s Note, ASME Journal of Electronic Packaging, September 1998.

201.  E. Suhir, “’Optical Glass Fiber Bent on a Cylindrical
Surface”, MRS Symposia Proceedings, vol.531, 1998. 

202.  E. Suhir, “The Future of Microelectronics and Photonics
and the Role of Mechanics and Materials”, ASME Journal of Electronic Packaging,
March 1998

 

1997

203.  E. Suhir, “The Future of Microelectronics and Photonics
and the Role of Mechanics and Materials”, ASME Journal of Electronic Packaging,
Editorial, March 1998, see also Proceedings of the Electronic Packaging and
Technology Conf., EPTC’97, Singapore, October 1997.

204.  E. Suhir, “Dynamic Response of Microelectronics and
Photonics Systems to Shocks and Vibrations”, Proceedings of the International
Conference on Microelectronics and Photonics Packaging, INTERPack’97, Hawaii,
June 15-19, 1997.

205.  E. Suhir, “Effect of Plastic Package Geometry on Its
Propensity to Moisture Induced Failure”, IMAPS/NATO Workshop Proceedings, Bled,
Slovenia, 1997

206.  E. Suhir, "Bending of a Partially Coated Glass
Fiber Subjected to the Ends Off-Set", Proc. of the 47-th Electr. Comp. and
Techn. Conference, IEEE, San Jose, CA, May 1997, see also IEEE CPMT
Transactions, June 1997.

207.  E. Suhir, “Solder Materials
and Joints in Fiber Optics: Reliability Requirements and Predicted Stresses”,
Proc. of the Int. Symp. on “Design and Reliability of Solders and Solder
Interconnections”, Orlando, Fl., Febr. 1997.

208.  E. Suhir, “Predicted Thermal Mismatch Stresses in a
Cylindrical Bi-Material Assembly Adhesively Bonded at the Ends”, ASME Journal
of Applied Mechanics, vol.64, No. 1, 1997.

209.  M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy
Molding Compounds Filled With Silica Particles”, in E. Suhir, ed., “Structural
Analysis in Microelectronics and Fiber Optics”, ASME Press, 1997.

210.  E. Suhir, “Is the Maximum Acceleration an Adequate Criterion
of  the Dynamic Strength of a Structural
Element in an Electronic Product?”, IEEE CPMT Transactions, Part A, vol.20,
No.4, December 1997.

211.  E. Suhir, “Probabilistic Approach to Evaluate
Improvements in the Reliability of Chip-Substrate (Chip-Card) Assembly“, IEEE
CPMT Transactions, Part A, vol. 20, No. 1, 1997.

212.  E. Suhir, “Failure Criterion for Moisture-Sensitive
Plastic Packages of Integrated Circuit (IC) Devices: Application of von-Karman
Equations with Consideration of Thermoelastic Strains”, Int. Journal of Solids
and Structures, vol. 34, No. 12, 1997

 

1996

213.  B. Welker, M. Uschitsky, E. Suhir, S. Kher, G. Bubel,
“Finite Element Analysis of the Optical Fiber Structures”, in E. Suhir, ed.,
“Structural Analysis in Microelectronics and Fiber Optics”, Symposium
Proceedings, ASME Press, 1996

214.  E. Suhir, “Predicted Curvature and Stresses in an
Optical Fiber Interconnect Subjected to Bending”, IEEE/OSA Journal of Lightwave
Technology, vol. 14, No. 2, 1996.

215.  E. Suhir, “Flex Circuit 
vs  Regular” Substrate: Predicted
Reduction in the Shearing Stress in Solder Joints”, Proc. of the 3-rd Int.
Conf. on Flexible Circuits FLEXCON 96, San-Jose, CA, Oct. 1996. 

216.  M. Uschitsky, E. Suhir, L. Shepherd, W.R. Lambert, and
M.A. Zimmerman, “Predicted Dynamic Strength and Durability of a Network
Interface Unit (NIU) Enclosure”, in E. Suhir, ed., Structural Analysis in
Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.

217.  E. Suhir, and Q.S.M. Ilyas, ““Thick” Plastic Packages
With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different is
Their Propensity to Moisture Induced Failures?”, in E. Suhir, ed., “Structural
Analysis in Micro-electronics and Fiber Optics”, Symposium Proceedings, ASME
Press, 1996.

218.  M. Uschitsky, E. Suhir, “Predicted Thermally Induced
Stresses in an Epoxy Molding Compound at the Chip Corner”, in E. Suhir, ed.,
“Structural Analysis in Microelectronics and Fiber Optics”, Symposium
Proceedings, ASME Press, 1996.

219.  E. Suhir, “Dynamic Response of a One-Degree-of-Freedom
Linear System to a Shock Load during Drop Tests: Effect of Viscous Damping”,
IEEE CPMT Transactions, Part A, vol. 19, No.3, 1996.

220.  E. Suhir, “Shock-Excited Vibrations of a Conservative
Duffing Oscillator with Application to Shock Protection in Portable
Electronics”, Int. Journal of Solids and Structures, vol. 33, No. 24, 1996.

 

1995

221.  E. Suhir, “Analysis and Optimization of the
Input/Output Fiber Configuration in a Laser Package Design”, ASME Journal of
Electronic Packaging, vol. 117, No. 4, 1995.

222.  M. Uschitsky, E. Suhir, S. Kher, and G. Bubel, “Epoxy
Bonded Optical Fibers: the Effect of Voids on Stress Concentration in the Epoxy
Material”, in E. Suhir, ed., “Structural Analysis in Microelectronic and Fiber
Optic Systems”, Symposium Proceedings, ASME Press, 1995.

223.  E. Suhir, V. Mishkevich, and J. Anderson, “How Large
Should a Periodic External Load Be to Cause Appreciable Microbending Losses in
a Dual-Coated Optical Fiber?”, in E. Suhir, ed., “Structural Analysis in
Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1995.

224.  E. Suhir, “Global” and “Local” Thermal Mismatch
Stresses in an Elongated Bi-Material Assembly Bonded at the Ends”, in E. Suhir,
ed., “Structural Analysis in Microelectronic and Fiber-Optic Systems”,
Symposium Proceedings, ASME Press, 1995.

225.  E. Suhir, “How Compliant Should a Die-Attachment Be to
Protect the Chip From Substrate (Card) Bowing?”, ASME Journal of Electronic
Packaging, vol. 117, No. 1, 1995.

226.  E. Suhir, “Shock Protection with a Nonlinear Spring”,
IEEE CPMT Transactions, Advanced Packaging, Part B, vol. 18, No. 2, 1995.

227.  E. Suhir, “Predicted Failure Criterion (von-Mises
Stress) in Plastic Packages During High Temperature Reflow Soldering”, 45-th
ECTC Proceedings, Las Vegas, May 1995.

 

1994

228.  E. Suhir, “Approximate Evaluation of the Elastic
Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate”,
ASME Journal of Electronic Packaging, vol. 116, No. 3, 1994.

229.  E. Suhir, “Approximate Evaluation of the Interfacial
Shearing Stress in Circular Double Lap Shear Joints, with Application to
Dual-Coated Optical Fibers”, Int. Journal of Solids and Structures, vol. 31,
No. 23, 1994.            

230.  E. Suhir, “Thermally Induced Stresses in an Optical
Glass Fiber Soldered into a Ferrule”, IEEE/OSA Journal of Lightwave Technology,
vol. 12, No. 10, 1994.

231.  E. Suhir, “Pull Testing of a Glass Fiber Soldered into
a Ferrule: How Long Should the Test Specimen Be?”, Applied Optics, vol. 33, No.
19, 1994.

232.  E. Suhir and R. Burke, “Analysis and Optimization of
the Dynamic Response of a Rectangular Plate to a Shock Load Acting on Its
Support Contour, With Application to Portable Electronic Products”, IEEE CHMT
Transactions, Advanced Packaging, Part B, vol. 17, No. 3, 1994.

 

1993

233.  E. Suhir, “Can the Curvature of an Optical Glass Fiber
be Different from the Curvature of Its Coating?”, Int. Journal of Solids and
Structures, vol. 30, No. 17, 1993.

234.  E. Suhir, “Predicted Stresses and Strains in Fused
Biconical Taper Couplers Subjected to Tension”, Applied Optics, vol. 32, No.
18, 1993.

235.  E. Suhir, “Analytical Modeling of the Interfacial
Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”,
Applied Optics, vol. 32, No. 16, 1993. 

236.  E. Suhir, “Effect of the Nonlinear Stress-Strain
Relationship on the Maximum Stress in Silica Fibers Subjected to Two-Point
Bending”, Applied Optics, vol. 32, No. 9, 1993.

237.  E. Suhir, “Analytical Modeling of the Interfacial
Shearing Stress During Pull-Out Testing of Dual-Coated Lightguide Specimens”,
Applied Optics, vol. 32, No. 7, 1993.

238.  V. Mishkevich and E. Suhir, “Simplified Approach to the
Evaluation of Thermally Induced Stresses in Bi-Material Structures”, in E.
Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME
Press, 1993.

239.  E. Suhir, “Mechanical Reliability of Flip-Chip
Interconnections in Silicon-on-Silicon Multichip Modules”, IEEE Conference on
Multichip Modules, IEEE, Santa Cruz, Calif., March 1993.

240.  E. Suhir, “Predicted Interfacial Shearing Stress in
Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 2, “The Case of
a Specimen Embedded into Epoxy”, ANTEC-93, 
May 1993, SPE, New Orleans, Louisiana.

241.  E. Suhir, “Predicted Interfacial Shearing Stress in
Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 1, “The Case of
a Cylindrical Double Lap Shear Joint”, ANTEC-93, May 1993, SPE, New Orleans,
Louisiana.

242.  E. Suhir, C. Paola, W. M. MacDonald, “Input/Output
Fiber Configuration in a Laser Package Design”, IEEE/OSA Journal of Lightwave
Technology, vol. 11, No. 12, 1993.

 

1992

243.  E. Suhir, “Free Vibrations of a Fused Biconical Taper
Lightwave Coupler”, Int. Journal of Solids and Structures, vol. 29, No. 24,
1992.

244.  E. Suhir, “Vibration Frequency of a Fused Biconical
Taper (FBT) Lightwave Coupler”, IEEE/OSA Journal of Lightwave Technology, vol.
10, No. 7, 1992.

245.  E. Suhir, “The Effect of the Nonlinear Behavior of the
Material on Two-Point Bending in Optical Glass Fibers”, ASME Journal of
Electronic Packaging, vol. 114, No. 2, 1992.

246.  E. Suhir, “Elastic Stability, Free Vibrations, and
Bending of Optical Glass Fibers: The Effect of the Nonlinear Stress-Strain
Relationship”, Applied Optics, vol. 31, No. 24, 1992.

247.  E. Suhir and T. M. Sullivan, “Novel Technique for the
Evaluation of the Adhesive Strength of the Epoxy Molding Compounds Used in
Plastic Packaging”, Proc. of the 42-nd Electr. Comp. and Techn. Conf., IEEE,
San-Diego, Calif., May 1992.

248.  E. Suhir, “Mechanical Behavior and Reliability of
Solder Joint Interconnections in Thermally Matched Assemblies”, Proc. of the
42-nd Electr. Comp. and Techn. Conf., IEEE, San-Diego, Calif., May 1992.

249.  E. Suhir, “Predicted Bow of Plastic Packages of
Integrated Circuit (IC) Devices”,  Proc.
of the 50-th SPE Conf., SPE, Detroit, MI, May 1992. See also Journal of
Reinforced Plastics and Composites, vol. 12, Sept. 1993.

250.  E. Suhir, “Response of a Flexible Printed Circuit Board
to Periodic Shock Loads Applied to Its Support Contour”, ASME Journal of
Applied Mechanics, vol. 59, No. 2, 1992.

251.  E. Suhir, “Nonlinear Dynamic Response of a  Flexible Thin Plate to Constant Acceleration
Applied to Its Support Contour, with Application to Printed Circuit Boards Used
in Avionic Packaging”, Int. Journal of Solids and Structures, vol. 29, No. 1,
1992.

252.  E. Suhir and L. T. Manzione, “Predicted Bow of Plastic
Packages Due to the Non-uniform Through-Thickness Distribution of Temperature”,
ASME Journal of Electronic Packaging, vol. 114, No. 3, 1992.

 

1991

253.  E. Suhir, “Approximate Evaluation of the Elastic
Interfacial Stresses in Thin Films with Application to High-Tc Superconducting
Ceramics”, Int. Journal of Solids and Structures, vol. 27, No. 8, 1991.

254.  E. Suhir, “Stress Relief in Solder Joints Due to the
Application of a Flex Circuit”, ASME Journal of Electronic Packaging, vol. 113,
No. 3, 1991.

255.  E. Suhir, “Nonlinear Dynamic Response of a Flexible
Printed Circuit Board to Shock Loads Applied to Its Support Contour”, Proc. of
the 41-st Elect. Comp. and Techn. Conf., IEEE, Atlanta, Georgia, May 1991.

256.  E. Suhir, G. M. Bubel, and R. D. Tuminaro, “Predicted
Curvature of the Glass Fiber from the Measured Curvature of Its Coating”,
IEEE/OSA Journal of Lightwave Technology, vol. 9, No. 6, 1991.

257.  E. Suhir, “Mechanical Behavior of Materials in
Microelectronic and Fiber Optic Systems: Application of Analytical
Modeling-Review”, MRS Symposia Proc., vol. 226, 1991.

258.  E. Suhir and L. T. Manzione, “Predicted Stresses in Wire
Bonds of Plastic Packages during Transfer Moldings”, ASME Journal of Electronic
Packaging, vol. 113, No. 1, 1991.

259.  E. Suhir, “A Plate Contactor in a Mechanical
Input/Output Connector Interface: How Small Can It Be?”, ASME Journal of
Electronic Packaging, vol. 113, No. 1, 1991.

260.  E. Suhir and L. T. Manzione, “Mechanical Deformation of
Lead Frame Assemblies in Plastic Packages during Molding”, ASME Journal of
Electronic Packaging, vol. 113, No. 4, 1991.

 

1990

261.  E. Suhir, “Stresses in a Coated Fiber Stretched on a
Capstan”, Applied Optics, vol. 29, No. 18, 1990.

262.  E. Suhir and J. M. Segelken, "Mechanical Behavior
of Flip-Chip Encapsulants”, ASME Journal of Electronic Packaging, vol. 112, No.
4, 1990.

263.  E. Suhir, “Buffering Effect of Fiber Coating and Its
Influence on the Proof-Test Load in Optical Fibers”, Applied Optics, vol. 29,
No. 18, 1990.

264.  E. Suhir, “Mechanical Approach to the Evaluation of the
Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical
Fibers”, IEEE/OSA Journal of Lightwave Technology, vol. 8, No. 6, 1990.

265.  E. Suhir, “Double-Sided Velcro-Type Input/Output
Contactor Interface Design: Mechanical Behavior of Elastic Contactors”, ASME
Journal of Electronic Packaging, vol. 112, No. 4, 1990.

266.  E. Suhir and B. Poborets, “Solder Glass Attachment in
Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical
Reliability”, Proc. of the 40th Elect. Comp. and Techn. Conf., Las Vegas,
Nevada, May 1990; See also: ASME Journal of Electronic Packaging, vol. 112, No.
2, 1990.

267.  E. Suhir, “How Long Should a Beam Specimen Be in
Bending Tests?”, ASME Journal of Electronic Packaging, vol. 112, No. 1, 1990.

268.  E. Suhir, “Predicted Mechanical Behavior of High-Tc
Superconducting Ceramic Films”, in T. Venkatesan, ed., “Processing of Films for
High-Tc Superconducting Electronics”, SPIE, Vol. 1187, 1990.

269.  E. Suhir and T. M. Sullivan, “Analysis of Interfacial
Thermal Stresses and Adhesive Strength of Bi-Annular Cylinders”, Int. Journal
of Solids and Structures, vol. 26, No. 6, 1990.

 

1989

270.  E. Suhir, “Interfacial Stresses in Bi-Metal
Thermostats”, ASME Journal of Applied Mechanics, vol. 56, No. 3, September
1989.

271.  E. Suhir, “Analytical Modeling in Structural Analysis
for Electronic Packaging: Its Merits, Shortcomings and Interaction with
Experimental and Numerical Techniques”, ASME Journal of Electronic Packaging,
vol. 111, No. 2, June 1989.

272.  E. Suhir, “Axisymmetric Elastic Deformations of a
Finite Circular Cylinder with Application to Low Temperature Strains and
Stresses in Solder Joints”, ASME Journal of Applied Mechanics, vol. 56, No. 2,
1989.

273.  E. Suhir, “Applications of an Epoxy Cap in a Flip-Chip
Package Design”, ASME Journal of Electronic Packaging, vol. 111, No. 1, 1989.

274.  E. Suhir, “Bending Performance of Clamped Optical
Fibers: Stresses Due to the End Off-Set”, Applied Optics, vol. 28, No. 3,
February 1989.

275.  E. Suhir, “Calculated Stresses in Microelectronic and
Fiber-Optic Structures”, Proc. of the 1st Pan American Congress of Applied
Mechanics, American Academy of Mechanics, Rio de Janeiro, Brazil, January 1989.

276.  E. Suhir, “Mechanical Behavior of Materials in
Microelectronic and Fiber-Optic Systems: Application of Analytical
Modeling-Review”, Preprint ASME 89-WA/EEP-16, 1989 Winter Annual Meeting,
San-Francisco, December 1989.

277.  E. Suhir, “Can Power Cycling Life of Solder Joint
Interconnections Be Assessed on the Basis of Temperature Cycling Tests?”, ASME
Journal of Electronic Packaging, vol. 111, No. 4, Dec. 1989.

278.  E. Suhir, “Thermally Induced Stresses in Elongated
Bi-Material Plates”, Applied Mechanics Reviews, 1989 Supplement, “Mechanics Pan
America 1989, Selected and Revised Proceedings of the January 1989 Rio de
Janeiro Pan American Congress of Applied Mechanics,  C. R. Steele, A. W. Leissa and M. R. M.
Crespo de Silva, eds., vol. 42, No. 11, part 2, Nov. 1989.

279.  E. Suhir, “Calculated Interfacial Stresses in Elongated
Bi-Material Plates Subjected to Bending”, ASME Journal of Electronic Packaging,
vol. 111, No. 4, Dec. 1989.

280.  E. Suhir, “Twist-off Testing of Solder Joint
Interconnections”,  ASME Journal of
Electronic Packaging, vol. 111, No. 3, Sept. 1989.

 

1988

281.  E. Suhir, “Stresses in Dual - Coated Optical Fibers”,
ASME Journal of Applied Mechanics, vol. 55, No. 10, 1988. 

282.  E. Suhir, “Spring Constant In the Buckling of
Dual-Coated Optical Fibers”, IEEE/OSA Journal of Lightwave Technology, vol. 6,
No. 7, 1988.

283.  E. Suhir, “Effect of Initial Curvature on Low
Temperature Microbending in Optical Fibers”, IEEE/OSA Journal of Lightwave
Technology, vol. 6, No. 8, 1988.

284.  E. Suhir, “An Approximate Analysis of Stresses in
Multilayer Elastic Thin Films”, ASME Journal of Applied Mechanics, vol. 55, No.
3, 1988.

285.  E. Suhir and J. M. Segelken, "Mechanical Behavior
of Flip-Chip Encapsulants”, Semicon/East Technical Proc., Semiconductor
Equipment and Materials International, Boston, Mass., Sept. 1988. Also: ASME
Journal of Electronic Packaging, vol. 112, No. 4, 1990.

286.  E. Suhir, “On a Paradoxical Phenomenon Related to Beams
on Elastic Foundation”, ASME Journal of Applied Mechanics, vol. 55, No. 10,
1988.

287.  E. Suhir, “Could Compliant External Leads Reduce the
Strength of a Surface Mounted Device?”, Proc. of the 38th Electr. Comp. Conf.,
IEEE, Los Angeles, Calif., May 1988.

288.  E. Suhir, “Calculated Stresses in Dual-Coated Fibers”,
Proc. of the SPE 46th Annual Technical Conference, ANTEC '88, Atlanta, Georgia,
May 1988.

 

1987

289.  E. Suhir, “Die Attachment Design and Its Influence on
the Thermally Induced Stresses in the Die and the Attachment”, Proc. of the
37th Elect. Comp. Conf., IEEE, Boston, Mass., May 1987.

290.  E. Suhir and W. E. Benedetto, “Mechanical Behavior of
the “Euler” Test Probe”, Preprint ASME 87-WA/EEP-5, 1987 Winter Annual Meeting,
Boston, Mass., Dec. 1987. See also: ASME Journal of Electronic Packaging, vol.
112, No. 1, 1990.

 

1986

291.  E. Suhir, “Calculated Thermally Induced Stresses in
Adhesively Bonded and Soldered Assemblies”, 
Proc. of the Int. Symp. on Microelectronics, ISHM, 1986, Atlanta,
Georgia, Oct. 1986. 

292.  E. Suhir, “Stresses in Bi-Metal Thermostats”, ASME
Journal of Applied Mechanics, vol. 53, No. 3, Sept. 1986.

293.  S. Luryi and E. Suhir, “A New Approach to the
High-Quality Epitaxial Growth of Lattice - Mismatched Materials”, Applied
Physics Letters, vol. 49, No. 3, July 1986.

 

1985

294.  E. Suhir, “Linear and Nonlinear Vibrations Caused by
Periodic Impulses”, AIAA/ASME/ASCE/AHS 26th Structures, Structural Dynamics and
Materials Conference, Orlando, Florida, April 1985.

 

1982

295.  E. Suhir, “Shock-Excited Vibrations with Application to
the Slamming Response of a Flexible Ship to a Regular Wave Packet”, SNAME
Journal of Ship Research, vol. 26, No. 4, 1982.