RELIABILITY ENGINEERING

ERS PATENTS

E. Suhir, “Apparatus for Attaching a Cooling Structure to an Integrated Circuit”, US Patent #7,477,527, 2009 

D. Ingman, V. Ogenko, E. Suhir, A. Glista, “Moisture Resistant Nano-Particle Material and Its Applications”, US Patent #7,321,714B2, 2008

E. Suhir, “Apparatus and Test Device for the Application and Measurement of Prescribed, Predicted and Controlled Contact Pressure on Wires”, US Patent #7,279,916, 2007

D. Ingman and E.Suhir, “Optical Fiber with Nano-Particle Overclad”, US Patent, #7,162,138 B2, 2007

D. Ingman and E.Suhir, “Optical Fiber with Nano-Particle Cladding”, US Patent, #7,162,137 B2, 2007 E. Suhir, “Coated Optical Glass Fiber”, US Patent #6,647,195, 2003.

E.Suhir, “Optical Fiber Interconnects Having Offset Ends with Reduced Tensile Strength and Fabrication Method”, US Patent #6,606,434, 2003

E. Suhir, “Bi-Material Assembly Adhesively Bonded at the Ends and Fabrication Method”, US Patent #6,460, 753, 2002

E. Suhir, “Strain Free Planar Optical Waveguides”, US Patent #6,389,209, 2002

E. Suhir, “Apparatus and Method for Thermostatic Compensation of Temperature Sensitive Devices”, US Patent #6,337,932, 2002

E.Suhir, “Method of Improving the Performance of Optical Fiber, which is Interconnected Between Two Misaligned Supports”, U.S. Patent #6,314,218, 2001

E. Suhir, “Interconnected Optical Devices Having Enhanced Reliability”, U.S. Patent #6,327,411, 2001

E. Suhir, “Arrangement for Reducing Bending Stress in an Electronics Package”, U.S. Patent #6,180,241, 2001

E. Suhir, “Device and Method of Controlling the Bowing of a Soldered or Adhesively Bonded Assembly,” US Patent #6,239,382, 2001.

E. Suhir, “Method for Determining and Optimizing the Curvature of a Glass Fiber for Reducing Fiber Stress”, US Patent #6,016,377, 2000

E. Suhir,  "Electronic Assembly Having Improved Resistance to Delamination", U.S. Patent #6,028,772, 2000

E. Suhir, “Method and Apparatus for Prooftesting Optical Fibers”, US Patent #6,119,527, 1998

E. Suhir, “Data Carriers Having an Integrated Circuit Unit”, US Patent #5,703,350, 1997

E. Suhir and J. Weld, “Electronic Package with Reduced Bending Stress”, US Patent #5,627,407, 1997.

E.Suhir, “Reduced Stress Wire Bond”,  application #20030197288,