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E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007 
E. Suhir, M. Fukuda, C. R. Kurkjian, eds., “Reliability of Photonic Materials and Structures”, Materials Research Society Symposia Proceedings, vol. 531, 1998.
E. Suhir, “Applied Probability for Engineers and Scientists”, McGraw Hill, New York, 1997. M. Schen, H. Abe, and E. Suhir, eds. “Thermal and Mechanical Behavior and Modeling”, ASME, AMD-Vol,1994
E. Suhir, “Structural Analysis in Microelectronic and Fiber Optic Systems”, vol.1, Basic Principles of Engineering Elasticity and Fundamentals of Structural Analysis”, Van Nostrand Reinhold, New York, 1991.
E. Suhir, R.C.Cammarata, D.D.L.Chung, M.Jono, “Mechanical Behavior of Materials and Structures in Microelectronics”, Materials Research Society Symposia Proceedings, vol.226, 1991.
E. Suhir, “Fiber-Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007
E. Suhir, “Dynamic Response of Micro-Electronic Systems to Shocks and Vibrations: Review and Extension”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007
V. Birman and E. Suhir, “Effect of Material’s Nonlinearity on the Mechanical Response of Some Piezo-Electric and Photonic Systems”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007
E. Suhir, “Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007
E. Suhir, “How to Make a Device into a Product: Accelerated Life Testing It’s Role, Attributes, Challenges, Pirfalls, and Interaction with Qualification Testing”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007
E. Suhir, D. Ingman, “Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007
E. Suhir, “Effect of Plastic Package Geometry on its Propensity to Moisture Induced Failure”, in R.Tummala, M.Kosec, W. Kinzy Jones and D. Belavic, eds., “Electronic Packaging for High Reliability: Low Cost Electronics”, NATO ASI Series, 3. “High Technology”, vol.57, Kluwer Academic Publishers, 1999.
E. Suhir, “Structural Analysis in Fiber Optics”, in J. Menon, ed., “Trends in Lightwave Technology”, Council of Scientific Information, India, 1995. E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit Devices”, in J. H. Lau, ed., Thermal Stress and Strain in Microelectronic Packaging”, Van Nostrand Reinhold, New York, 1993. E. Suhir and Y.C. Lee, “Thermal, Mechanical and Environmental Durability Design Methodologies in Electronic Packaging”, in “Handbook of Electronic Materials”, ASM International, 1990. E. Suhir, “Thermal Stress Failures in Microelectronic Components - Review and Extension”, in A. Bar-Cohen and A. D. Kraus, eds., “Advances in Thermal Modeling of Electronic Components and Systems”, Hemisphere, New York, 1988.  

PAPERS         

2009 E.Suhir,  M. Vujosevic, and T. Reinikainen,  “Nonlinear Dynamic Response of a “Flexible-and-Heavy” Printed Circuit Board (PCB) to an Impact Load Applied to Its Support Contour”, Journal of Applied Physics, D, 42, No.4, 2009 E. Suhir, “Stretchable Electronics: Does One Need a Good Thermal Expansion Match Between the Si Die and the Plastic Carrier?”, IEEE ECTC 2009, accepted T. Reinikainen and E.Suhir, “Novel Shear Test Methodology for the Most Accurate Assessment of Solder Material Properties”, IEEE ECTC 2009, accepted
E. Suhir, “Lateral Compliance and Elastic Stability of a Dual-Coated Optical Fiber of Finite Length, with Application to Nano-Rods Embedded in Low-Modulus Elastic Media”, IEEE ECTC 2009 accepted
E.Suhir and M. Vujosevic, “Predicted Fundamental Frequency of Free Vibrations of a PCB with a Concentrated ("Lump") Mass at its Center”, The European Physical Journal AP section , 2009, submitted,
E. Suhir, “Thermal Stress in a Bi-Material Assembly with a “Piecewise-Continuous” Bonding Layer: Theorem of Three Axial Forces”, Journal of Applied Physics, D, 2009,accepted
E. Suhir, “The Coordinate Function in the Problem of the Nonlinear Dynamic Response of an Elongated Printed Circuit Board (PCB) to a Drop Impact Applied to Its Support Contour”, Journal of Applied Physics, D, Nonlinearity, 2009, submitted
E. Suhir, “Could an Impact Load of Finite Duration Acting on a Duffing Oscillator Be Substituted with an Instantaneous Impulse?”, Journal of Applied Physics, D, Nonlinearity, 2009, submitted E.Suhir, “Analytical Thermal Stress  Modeling in Electronic and Photonic Systems”, ASME Applied Mechanics Reviews, invited paper, 2009, in print
E. Suhir, “Human Factor in Safety-at-Sea Situations: Could It Be Quantified”?, ASME OMAE Transactions, 2009, submitted
E.Suhir, “Helicopter-Landing-Ship: Probabilistic Modeling with Consideration of the Role of the Human Factor”, ASME OMAE Conference, 2009, accepted 2008
Y.Zhang, E.Suhir, C.Gu, “Carbon Nanotubes/Nanofibers as Thermal Interface Materials (TIMs): Physical/Mechanical Properties and Requirements”, Invited Review Paper, Taiwan, to be published E.Suhir and M. Vujosevic, “Interfacial Stresses in a Bi-material Assembly with a Compliant Bonding Layer”, Journal of Applied Physics D, vol.41, 2008
E.Suhir and T. Reinikainen, “On a Paradoxical Situation Related to Lap Shear Joints: Could Transverse Grooves in the Adherends Lead to Lower Interfacial Stresses?”, Journal of Applied Physics D, vol.41, 2008
E. Suhir, “Lateral Compliance of a Compressed Cantilever Beam, with Application to Micro-Electronic and Fiber-Optic Structures”, Journal of Applied Physics D, vol.41,No.1,  2008
I.S.Bayer, A.Biswas, J.B.Szczech, E.Suhir, M.G.Norton, “Radio Frequency Functional Capacitors Made of All-Organic Composites of Thiourea in Field-Responsive Polymers for Embedded Applications”, Applied Physics Letters, vol. 92, No.1, 2008.   2007
T. Mirer, D. Ingman, E. Suhir, “Reliability Improvement Through Nano-Particle-Material-Based Fiber Structures”, Optical Fiber Technology, v. 13, 2007,pp.27-31.
E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber of Finite Length”, Journal of Applied Physics, vol.102, No.5, 2007
E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber with a Stripped Off Coating at Its End”, Journal of Applied Physics, vol. 102, No.4, 2007
E. Suhir, “Response of a Heavy Electronic Component to Harmonic Excitations Applied to Its External Electric Leads”, Elektrotechnik & Informationstechnik (Austria), vol.9, 2007
E, Suhir, “Dynamic Response of Micro-Electronic Structural Elements to Shocks and Vibrations”, Keynote presentation, MicroNanoReliability Congress, Berlin-Koepenick, September 2-5, 2007
E. Suhir, “Polymeric Coating of Optical Silica Fibers, and a Nanomaterial-Based Coating System”, Keynote Presentation,  Polytronic’2007, Proceedings of the International Conference on Polymeric Materials for Micro- and Opto-Electronics Applications, Tokyo, Japan, January 14-16, 2007   2006
E.Suhir, “Interfacial Thermal Stresses in a Bi-Material Assembly with a Low-Yield-Stress Bonding Layer”, Modeling and Simulation in Materials Science and Engineering, vol. 14, 2006, pp.1421-1432
Yuan Xu, Yi Zhang, Ephraim Suhir, and Xinwei Wang, ” Thermal Properties of Carbon Nanotube Array for Integrated Circuits Cooling” Journal of Applied Physics,100, 074302, 2006
Yi Zhang, Yuan Xu and Ephraim Suhir,  “Effect of Rapid Thermal Annealing (RTA) on Thermal Properties of Carbon Nanofibre (CNF) Arrays”, Journal of Physics D: Applied Physics ,39, 2006, pp.4878-4885
Yi Zhang, Yuan Xu and Ephraim Suhir,  “Effective Young’s Modulus of Carbon Nanofiber Array”,  Journal of Materials Research,vol.21, No.11, Nov. 2006
Yi Zhang, Ephraim Suhir, Yuan Xu, and Claire Gu, "Bonding Strength of Carbon Nanofiber Array to its Substrate”,  Journal of Materials Research,vol. 21, No.11, Nov.2006
Yi. Zhang, Yuan Xu, Claire Gu and Ephraim Suhir, “Predicted Shear-off Stress in Bonded Assemblies: Review and Extension” ASTR 2006, San Francisco, CA, 2006
E. Suhir, “Fiber Optics Structural Mechanics, and a New Generation of Nano-Technology Based Optical Fiber Cladding and Coating”, Invited talk at the Photonics West Conf., and SPIE Publication, 2006 E. Suhir, D. Ingman, “Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications”, ECTC’06 Proceedings, San Diego, May 2006   2005
E.Suhir, “Reliability and Accelerated Life Testing”, Semiconductor International, February 1, 2005. E.Suhir, “Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results”, Invited Talk, Therminic, 2005, Lago Maggiore, Italy, September 27-30, 2005
E.Suhir, “Mechanics of Coated Optical Fibers: Review and Extension”, ECTC’2005, Orlando, Florida, 2005
E. Suhir, “Microelectronic and Photonic Systems: Role of Structural Analysis”, InterPack’2005, San Francisco, July 2005
E. Suhir, “New Nano-Particle Material (NPM) for Micro- and Opto-Electronic Packaging Applications”, IEEE Workshop on Advanced Packaging Materials, Irvine, March 2005.   2004
E. Suhir, “Bow-Free Assemblies: Predicted Stresses”, Therminic’2004, Niece, France, Sept. 29-Oct.1, 2004
E. Suhir, “Polymer Coated Optical Glass Fiber Reliability: Could Nano-Technology Make a Difference?”, Polytronic’04, Portland, OR, September 13-15, 2004
E. Suhir, “Crossing the Lines, or Should We Just Mind Our Own Business?”, Feature Article, Mechanical Engineering, 2004   2003
E. Suhir, “Thermal Stress in an Adhesively Bonded Joint with a Low Modulus Adhesive Layer at the Ends”,  Journal  of Applied Physics, April 2003.
E. Suhir, “Thermal Stress Modeling in Micro- and Opto-Electronics: Review and Extension”, Invited Presentation, ASME Symposium Dedicated to Dr. Richard Chu, IBM, Washington, DC, November 2003
E. Suhir, “Polymer Coated Optical Glass Fibers: Review and Extension”, Proceedings of the POLYTRONIK’2003, Montreaux, October 21-24, 2003.
E. Suhir, “Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges and Brief Review”, Special Issue, ASME Journal of Electronic Packaging, vol.125, No.2, June 2003.
E. Suhir, V.Ogenko, D. Ingman, “Two-Point Bending of Coated Optical Fibers”, Proceedings of the PhoMat’2003 Conference, San-Francisco, CA, August 2003
E. Suhir, “How to Make a Photonic Device Into a Product: Role of Accelerated Life Testing”, Keynote Address at the International Conference of Business Aspects of Microelectronic Industry, Hong-Kong, January 2003.
E. Suhir, “Bow Free Adhesively Bonded Assemblies: Predicted Stresses”, Electrotechnik & Informationtechnik, 120 (6), June 2003.   2002
E. Suhir, “Analytical Stress-Strain Modeling in Photonics Engineering: Its Role, Attributes and Interaction with the Finite-Element Method”, Laser Focus World, May 2002.
E. Suhir, “Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests”, Keynote address at the SPIE’s 7-th Annual International Symposium on Nondestructive Evaluations for Health Monitoring and Diagnostics, 17-21 March, San Diego, CA, 2002
E. Suhir, Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests, Journal of Electronic Packaging -- September 2002 -- Volume 124, Issue 3, pp. 281-291
E.Suhir, “Could Shock Tests Adequately Mimic Drop Test Conditions?”, IEEE ECTC Conference Proceedings, San-Diego, CA, May 28-31, 2002   2001 E. Suhir, “Thermal Stress in a Polymer Coated Optical Glass Fiber with a Low Modulus Coating at the Ends”, Journal of Materials Research, vol. 16,  No. 10,   2001
E. Suhir, “Thermomechanical Stress Modeling in Microelectronics and Photonics”, Electronic Cooling, vol.7, No.4, 2001
M. Ushitsky, E. Suhir, G.W. Kammlott, “Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach”, ASME Journal of Electronic Packaging, vol.123, No.4, 2001 E. Suhir, “Adequate Underkeel Clearance (UKC) for a Ship Passing a Shallow Waterway: Application of the Extreme Value Distribution (EVD)”, Proceedings of OMAE2001 Conference, Paper OMAE2001/S&R-2113, Rio de Janeiro, Brazil, 2001
E. Suhir, "Analysis of Interfacial Thermal Stresses in a Tri-Material Assembly", Journal of Applied Physics, vol.89, No.7, 2001
E. Suhir, “Thermal Stress in a Bi-Material Assembly Adhesively Bonded at the Ends”, Journal of Applied Physics, vol. 89, No.1, 2001.
M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy Molding Compounds Filled with Particles", ASME Journal of Electronic Packaging, vol.123, No.1, 2001.   2000
E. Suhir, “Microelectronics and Photonics – the Future”, Microelectronics Journal, vol.31, No.11-12, 2000 E. Suhir, and J.J. Vuillamin, Jr, "Effects of the CTE and Young's Modulus Lateral Gradients on the Bowing of an Optical Fiber: Analytical and Finite Element Modeling", Optical Engineering, vol. 39, No. 12, 2000 E. Suhir, “Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board”, ASME Journal of Electronic Packaging, vol.122, No.1, 2000 E.Suhir, “Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review”, ASME Journal of Electronic Packaging, vol.121, No.3, 2000
E. Suhir, “Thermal Stress Modeling in Microelectronics and Photonics Packaging, and the Application of the Probabilistic Approach: Review and Extension”, IMAPS International Journal of Microcircuits and Electronic Packaging, vol.23, No.2, 2000 (invited paper)
E. Suhir, “Modeling of the Mechanical Behavior of Microelectronic and Photonic Systems: Attributes, Merits, Shortcomings, and Interaction with Experiment”, Proceedings of the 9-th Int. Congress on Experimental Mechanics, Orlando, Fl., June 5-8, 2000
E. Suhir, “Predicted Stresses in a Circular Substrate/Thin-Film System Subjected to the Change in Temperature”,  Journal of Applied Physics, vol.88, No.5, 2000
E.Suhir, “The Future of Microelectronics and Photonics, and the Role of Mechanical, Materials and Reliability Engineering”, Proceedings of the International Conference on Materials in Microelectronics, MicroMat 2000, April 17-19, 2000, Berlin, Germany
E.Suhir, “Silica Optical Fiber Interconnects: Design for Reliability”, Proceedings of the Annual Conference of the American Ceramic Society, St.-Louis, MO, May 3, 2000
E.Suhir, “Optical Fiber Interconnect with the Ends Offset and Axial Loading: What Could Be Done to Reduce the Tensile Stress in the Fiber”?, Journal of Applied Physics, vol.88, No.7,

2000
E. Suhir, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and “Piecewise Continuous” Adhesive Layer: Predicted Thermal Stresses and Displacements in the Adhesive”, Int. Journal of Solids and Structures, vol.37, 2000   1999
E. Suhir, “Thermal Stress Failures in Microelectronics and Photonics: Prediction and Prevention”, Future Circuits International, issue 5, 1999
E. Suhir, “Adhesively  Bonded Assemblies with Identical Nondeformable Adherends: Predicted Thermal Stresses in the Adhesive Layer”, Composite Interfaces, vol.6, No.2, 1999
E. Suhir, “Optimized Configuration of an Optical fiber “Pigtail” Bent on a Cylindrical Surface”, in T. Winkler and A, Schubert, eds., “Materials Mechanics, Fracture Mechanics, Micromechanics”, An Anniversary Volume in Honor of B. Michel’s 50th Birthday, Fraunhofer IZM, Berlin, 1999
E.Suhir, “Elastic Stability of the Glass Fibers in a Micromachined Fiber-Optic Switch Packaged into a Dual-in-Line Ceramic Package”, ECTC, 1999   1998
E. Suhir, “Coated Optical Fiber Interconnect Subjected to the Ends Off-Set and Axial Loading”, International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2, 1998, ASME Press, 1998.
E. Suhir, “Critical Strain and Postbuckling Stress in Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?”, International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2, 1998, ASME Press, 1998.
E. Suhir, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and Nonhomogeneous  Adhesive Layer: Predicted Thermal Stresses in the Adhesive”, Journal of Reinforced Plastics and Composites, vol.17, No.14, 1998
E. Suhir,   “Bending Stress in an Optical Fiber Interconnect Experiencing Significant Ends Off-Set”, MRS Symposia Proceedings, vol. 531, 1998.
E. Suhir, “Optical Fiber Interconnect Subjected to a Not-Very-Small Ends Off-Set: Effect of the Reactive Tension”, MRS Symposia Proceedings, vol. 531, 1998.
E. Suhir, “Fiber Optic Structural Mechanics – Brief Review”, Editor’s Note, ASME Journal of Electronic Packaging, September 1998.
E. Suhir, “’Optical Glass Fiber Bent on a Cylindrical Surface”, MRS Symposia Proceedings, vol.531, 1998.
E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and    Materials”, ASME Journal of Electronic Packaging, March 1998   1997
E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials”, ASME Journal of Electronic Packaging, Editorial, March 1998, see also Proceedings of the Electronic Packaging and Technology Conf., EPTC’97, Singapore, October 1997.
E. Suhir, “Dynamic Response of Microelectronics and Photonics Systems to Shocks and Vibrations”, Proceedings of the International Conference on Microelectronics and Photonics Packaging, INTERPack’97, Hawaii, June 15-19, 1997.
E. Suhir, “Effect of Plastic Package Geometry on Its Propensity to Moisture Induced Failure”, IMAPS/NATO Workshop Proceedings, Bled, Slovenia, 1997
E. Suhir, "Bending of a Partially Coated Glass Fiber Subjected to the Ends Off-Set", Proc. of the 47-th Electr. Comp. and Techn. Conference,  IEEE, San Jose, CA, May 1997, see also IEEE CPMT Transactions, June 1997. E. Suhir, “Solder Materials and Joints in Fiber Optics: Reliability Requirements and Predicted Stresses”, Proc. of the Int. Symp. on “Design and Reliability of Solders and Solder Interconnections”, Orlando, Fl., Febr. 1997.
E. Suhir, “Predicted Thermal Mismatch Stresses in a Cylindrical Bi-Material Assembly Adhesively Bonded at the Ends”, ASME Journal of Applied Mechanics, vol.64, No. 1, 1997.
M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1997.
E. Suhir, “Is the Maximum Acceleration an Adequate Criterion of  the Dynamic Strength of a Structural Element in an Electronic Product?”, IEEE CPMT Transactions, Part A, vol.20, No.4, December 1997.
E. Suhir, “Probabilistic Approach to Evaluate Improvements in the Reliability of Chip-Substrate (Chip-Card) Assembly“, IEEE CPMT Transactions, Part A, vol. 20, No. 1, 1997.
E. Suhir, “Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application of von-Karman Equations with Consideration of Thermoelastic Strains”, Int. Journal of Solids and Structures, vol. 34, No. 12, 1997   1996
B. Welker, M. Uschitsky, E. Suhir, S. Kher, G. Bubel, “Finite Element Analysis of the Optical Fiber Structures”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996 E. Suhir, “Predicted Curvature and Stresses in an Optical Fiber Interconnect Subjected to Bending”, IEEE/OSA Journal of Lightwave Technology, vol. 14, No. 2, 1996.
E. Suhir, “Flex Circuit  vs  Regular” Substrate: Predicted Reduction in the Shearing Stress in Solder Joints”, Proc. of the 3-rd Int. Conf. on Flexible Circuits FLEXCON 96, San-Jose, CA, Oct. 1996.
M. Uschitsky, E. Suhir, L. Shepherd, W.R. Lambert, and M.A. Zimmerman, “Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure”, in E. Suhir, ed., Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.
E. Suhir, and Q.S.M. Ilyas, ““Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different is Their Propensity to Moisture Induced Failures?”, in E. Suhir, ed., “Structural Analysis in Micro-electronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.
M. Uschitsky, E. Suhir, “Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.
E. Suhir, “Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load During  Drop Tests: Effect of Viscous Damping”, IEEE CPMT Transactions, Part A, vol. 19, No.3, 1996.
E. Suhir, “Shock-Excited Vibrations of a Conservative Duffing Oscillator With Application to Shock Protection in Portable Electronics”, Int. Journal of Solids and Structures, vol. 33, No. 24, 1996.  

1995
E. Suhir, “Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design”, ASME Journal of Electronic Packaging, vol. 117, No. 4, 1995.
M. Uschitsky, E. Suhir, S. Kher, and G. Bubel, “Epoxy Bonded Optical Fibers: the Effect of Voids on Stress Concentration in the Epoxy Material”, in E. Suhir, ed., “Structural Analysis in Microelectronic and Fiber Optic Systems”, Symposium Proceedings, ASME Press, 1995.
E. Suhir, V. Mishkevich, and J. Anderson, “How Large Should a Periodic External Load Be to Cause Appreciable Microbending Losses in a Dual-Coated Optical Fiber?”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1995.
E. Suhir, “Global” and “Local” Thermal  Mismatch Stresses in an Elongated Bi-Material Assembly Bonded at the Ends”, in E. Suhir, ed., “Structural Analysis in Microelectronic and Fiber-Optic Systems”, Symposium Proceedings, ASME Press, 1995.
E. Suhir, “How Compliant Should a Die-Attachment Be to Protect the Chip From Substrate (Card) Bowing?”, ASME Journal of Electronic Packaging, vol. 117, No. 1, 1995. E. Suhir, “Shock Protection with a Nonlinear Spring”, IEEE CPMT Transactions, Advanced  Packaging, Part B, vol. 18, No. 2, 1995.
E. Suhir, “Predicted Failure Criterion (von-Mises Stress) in Plastic Packages During High Temperature Reflow Soldering”, 45-th ECTC Proceedings, Las Vegas, May 1995.   1994
E. Suhir, “Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate”, ASME Journal of Electronic Packaging, vol. 116, No. 3, 1994.
E. Suhir, “Approximate Evaluation of the Interfacial Shearing Stress in Circular Double Lap Shear Joints, with Application to Dual-Coated Optical Fibers”, Int. Journal of Solids and Structures, vol. 31, No. 23, 1994.          
E. Suhir, “Thermally Induced Stresses in an Optical Glass Fiber Soldered into a Ferrule”, IEEE/OSA Journal of Lightwave Technology, vol. 12, No. 10, 1994. E. Suhir, “Pull Testing of a Glass Fiber Soldered into a Ferrule: How Long Should the Test Specimen Be?”, Applied Optics, vol. 33, No. 19, 1994.
E. Suhir and R. Burke, “Analysis and Optimization of the Dynamic Response of a Rectangular Plate to a Shock Load Acting on Its Support Contour, With Application to Portable Electronic Products”, IEEE CHMT Transactions, Advanced Packaging, Part B, vol. 17, No. 3, 1994.  

1993
E. Suhir, “Can the Curvature of an Optical Glass Fiber be Different From the Curvature of Its Coating?”, Int. Journal of Solids and Structures, vol. 30, No. 17, 1993.
E. Suhir, “Predicted Stresses and Strains in Fused Biconical Taper Couplers Subjected to Tension”, Applied Optics, vol. 32, No. 18, 1993.
E. Suhir, “Analytical Modeling of the Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Applied Optics, vol. 32, No. 16, 1993.
E. Suhir, “Effect of the Nonlinear Stress-Strain Relationship on the Maximum Stress in Silica Fibers Subjected to Two-Point Bending”, Applied Optics, vol. 32, No. 9, 1993.
E. Suhir, “Analytical Modeling of the Interfacial Shearing Stress During Pull-Out Testing of Dual-Coated Lightguide Specimens”, Applied Optics, vol. 32, No. 7, 1993.
V. Mishkevich and E. Suhir, “Simplified Approach to the Evaluation of Thermally Induced Stresses in Bi-Material Structures”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1993.
E. Suhir, “Mechanical  Reliability of Flip-Chip Interconnections in Silicon-on-Silicon Multichip Modules”, IEEE Conference on Multichip Modules, IEEE, Santa Cruz, Calif., March 1993.
E. Suhir, “Predicted Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 2, “The Case of a Specimen Embedded into Epoxy”, ANTEC-93,  May 1993, SPE, New Orleans, Louisiana.
E. Suhir, “Predicted Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 1, “The Case of a Cylindrical Double Lap Shear Joint”, ANTEC-93, May 1993, SPE, New Orleans, Louisiana. E. Suhir, C. Paola, W. M. MacDonald, “Input/Output Fiber Configuration in a Laser Package Design”, IEEE/OSA Journal of Lightwave Technology, vol. 11, No. 12, 1993.  

1992
E. Suhir, “Free Vibrations of a Fused Biconical Taper Lightwave Coupler”, Int. Journal of Solids and Structures, vol. 29, No. 24, 1992. E. Suhir, “Vibration Frequency of a Fused Biconical Taper (FBT) Lightwave Coupler”, IEEE/OSA Journal of Lightwave Technology, vol. 10, No. 7, 1992. E. Suhir, “The Effect of the Nonlinear Behavior of the Material on Two-Point Bending in Optical Glass Fibers”, ASME Journal of Electronic Packaging, vol. 114, No. 2, 1992.
E. Suhir, “Elastic Stability, Free Vibrations, and Bending of Optical Glass Fibers: The Effect of the Nonlinear Stress-Strain Relationship”, Applied Optics, vol. 31, No. 24, 1992.
E. Suhir and T. M. Sullivan, “Novel Technique for the Evaluation of the Adhesive Strength of the Epoxy Molding Compounds Used in Plastic Packaging”, Proc. of the 42-nd Electr. Comp. and Techn. Conf., IEEE, San-Diego, Calif., May 1992.
E. Suhir, “Mechanical Behavior and Reliability of Solder Joint Interconnections in Thermally Matched Assemblies”, Proc. of the 42-nd Electr. Comp. and Techn. Conf., IEEE, San-Diego, Calif., May 1992.
E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices”,  Proc. of the 50-th SPE Conf., SPE, Detroit, MI, May 1992. See also Journal of Reinforced Plastics and Composites, vol. 12, Sept. 1993.
E. Suhir, “Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to Its Support Contour”, ASME Journal of Applied Mechanics, vol. 59, No. 2, 1992.
E. Suhir, “Nonlinear Dynamic Response of a  Flexible Thin Plate to Constant Acceleration Applied to Its Support Contour, with Application to Printed Circuit Boards Used in Avionic Packaging”, Int. Journal of Solids and Structures, vol. 29, No. 1, 1992.
E. Suhir and L. T. Manzione, “Predicted Bow of Plastic Packages Due to the Non-uniform Through-Thickness Distribution of Temperature”, ASME Journal of Electronic Packaging, vol. 114, No. 3, 1992.  

1991
E. Suhir, “Approximate Evaluation of the Elastic Interfacial Stresses in Thin Films with Application to High-Tc Superconducting Ceramics”, Int. Journal of Solids and Structures, vol. 27, No. 8, 1991. E. Suhir, “Stress Relief in Solder Joints Due to the Application of a Flex Circuit”, ASME Journal of Electronic Packaging, vol. 113, No. 3, 1991.
E. Suhir, “Nonlinear Dynamic Response of a Flexible Printed Circuit Board to Shock Loads Applied to Its Support Contour”, Proc. of the 41-st Elect. Comp. and Techn. Conf., IEEE, Atlanta, Georgia, May 1991.
E. Suhir, G. M. Bubel, and R. D. Tuminaro, “Predicted Curvature of the Glass Fiber from the Measured Curvature of Its Coating”, IEEE/OSA Journal of Lightwave Technology, vol. 9, No. 6, 1991.
E. Suhir, “Mechanical Behavior of Materials in Microelectronic and Fiber Optic Systems: Application of Analytical Modeling-Review”, MRS Symposia Proc., vol. 226, 1991. E. Suhir and L. T. Manzione, “Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Moldings”, ASME Journal of Electronic Packaging, vol. 113, No. 1, 1991. E. Suhir, “A Plate Contactor in a Mechanical Input/Output Connector Interface: How Small Can It Be?”, ASME Journal of Electronic Packaging, vol. 113, No. 1, 1991.
E. Suhir and L. T. Manzione, “Mechanical Deformation of Lead Frame Assemblies in Plastic Packages During Molding”, ASME Journal of Electronic Packaging, vol. 113, No. 4, 1991.  

1990
E. Suhir, “Stresses in a Coated Fiber Stretched on a Capstan”, Applied Optics, vol. 29, No. 18, 1990.
E. Suhir and J. M. Segelken, "Mechanical Behavior of Flip-Chip Encapsulants”, ASME Journal of Electronic Packaging, vol. 112, No. 4, 1990.
E. Suhir, “Buffering Effect of Fiber Coating and Its Influence on the Proof-Test Load in Optical Fibers”, Applied Optics, vol. 29, No. 18, 1990.
E. Suhir, “Mechanical Approach to the Evaluation of the Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical Fibers”, IEEE/OSA Journal of Lightwave Technology, vol. 8, No. 6, 1990.
E. Suhir, “Double-Sided Velcro-Type Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors”, ASME Journal of Electronic Packaging, vol. 112, No. 4, 1990.
E. Suhir and B. Poborets, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability”, Proc. of the 40th Elect. Comp. and Techn. Conf., Las Vegas, Nevada, May 1990; See also: ASME Journal of Electronic Packaging, vol. 112, No. 2, 1990.
E. Suhir, “How Long Should a Beam Specimen Be in Bending Tests?”, ASME Journal of Electronic Packaging, vol. 112, No. 1, 1990. E. Suhir, “Predicted Mechanical Behavior of High-Tc Superconducting Ceramic Films”, in T. Venkatesan, ed., “Processing of Films for  High-Tc Superconducting Electronics”, SPIE, Vol. 1187, 1990.
E. Suhir and T. M. Sullivan, “Analysis of Interfacial Thermal Stresses and Adhesive Strength of Bi-Annular Cylinders”, Int. Journal of Solids and Structures, vol. 26, No. 6, 1990.  

1989
E. Suhir, “Interfacial Stresses in Bi-Metal Thermostats”, ASME Journal of Applied Mechanics, vol. 56, No. 3, September 1989.
E. Suhir, “Analytical Modeling in Structural Analysis for Electronic Packaging: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques”, ASME Journal of Electronic Packaging, vol. 111, No. 2, June 1989.
E. Suhir, “Axisymmetric Elastic Deformations of a Finite Circular Cylinder with Application to Low Temperature Strains and Stresses in Solder Joints”, ASME Journal of Applied Mechanics, vol. 56, No. 2, 1989.
E. Suhir, “Applications of an Epoxy Cap in a Flip-Chip Package Design”, ASME Journal of Electronic Packaging, vol. 111, No. 1, 1989.
E. Suhir, “Bending Performance of Clamped Optical Fibers: Stresses Due to the End Off-Set”, Applied Optics, vol. 28, No. 3, February 1989.
E. Suhir, “Calculated Stresses in Microelectronic and Fiber-Optic Structures”, Proc. of the 1st Pan American Congress of Applied Mechanics, American Academy of Mechanics, Rio de Janiero, Brazil, January 1989.
E. Suhir, “Mechanical Behavior of Materials in Microelectronic and Fiber-Optic Systems: Application of Analytical Modeling-Review”, Preprint ASME 89-WA/EEP-16, 1989 Winter Annual Meeting, San-Francisco, December 1989.
E. Suhir, “Can Power Cycling Life of Solder Joint Interconnections  Be Assessed on the Basis of Temperature Cycling Tests?”,  ASME Journal of Electronic Packaging, vol. 111, No. 4, Dec. 1989.
E. Suhir, “Thermally Induced Stresses in Elongated Bi-Material Plates”, Applied Mechanics Reviews, 1989 Supplement, “Mechanics Pan America 1989, Selected and Revised Proceedings of the January 1989 Rio de Janeiro Pan American Congress of Applied Mechanics,  C. R. Steele, A. W. Leissa and M. R. M. Crespo de Silva, eds., vol. 42, No. 11, part 2, Nov. 1989.
E. Suhir, “Calculated Interfacial Stresses in Elongated Bi-Material Plates Subjected to Bending”, ASME Journal of Electronic Packaging, vol. 111, No. 4, Dec. 1989.
E. Suhir, “Twist-off Testing of Solder Joint Interconnections”,  ASME Journal of Electronic Packaging, vol. 111, No. 3, Sept. 1989.
E. Suhir, “Applications of an Epoxy Cap in a Flip-Chip Package  Design”, ASME Journal of Electronic Packaging, vol. 111, No. 1, 1989.
E. Suhir, “Calculated Stresses in Microelectronic and  Fiber-Optic Structures”, Proc. of the 1st Pan American Congress of Applied Mechanics, American Academy of Mechanics, Rio de Janiero, Brazil, January 1989.
E. Suhir, “Thermally Induced Interfacial Stresses in Elongated Bi-Material Plates”, Proc. of the 1st Pan American Congress of Applied Mechanics, American Academy of Mechanics, Rio de Janeiro, Brazil, January 1989.  

1988
E. Suhir, “Stresses in Dual - Coated Optical Fibers”, ASME Journal of Applied Mechanics, vol. 55, No. 10, 1988. E. Suhir, “Spring Constant In the Buckling of Dual-Coated Optical Fibers”, IEEE/OSA Journal of Lightwave Technology, vol. 6, No. 7, 1988.
E. Suhir, “Effect of Initial Curvature on Low Temperature Microbending in Optical Fibers”, IEEE/OSA Journal of Lightwave Technology, vol. 6, No. 8, 1988.
E. Suhir, “An Approximate Analysis of Stresses in Multilayer Elastic Thin Films”, ASME Journal of Applied Mechanics, vol. 55, No. 3, 1988.
E. Suhir and J. M. Segelken, "Mechanical Behavior of Flip-Chip Encapsulants”, Semicon/East Technical Proc., Semiconductor Equipment  and  Materials  International, Boston, Mass., Sept. 1988. Also: ASME Journal of Electronic Packaging, vol. 112, No. 4, 1990. E. Suhir, “On a Paradoxical Phenomenon Related to Beams on Elastic Foundation”, ASME Journal of Applied Mechanics, vol. 55, No. 10, 1988.
E. Suhir, “Could Compliant External Leads Reduce the Strength of a Surface Mounted Device?”, Proc. of the 38th Electr. Comp. Conf., IEEE, Los Angeles, Calif., May 1988.
E. Suhir, “Calculated Stresses in Dual-Coated Fibers”, Proc. of the SPE 46th Annual Technical Conference, ANTEC '88, Atlanta, Georgia, May 1988.   1987
E. Suhir, “Die Attachment Design and Its Influence on the Thermally Induced Stresses in the Die and the Attachment”, Proc. of the 37th Elect. Comp. Conf., IEEE, Boston, Mass., May 1987.
E. Suhir and W. E. Benedetto, “Mechanical Behavior of the “Euler” Test Probe”, Preprint ASME 87-WA/EEP-5, 1987 Winter Annual Meeting, Boston, Mass., Dec. 1987. See also: ASME Journal of Electronic Packaging, vol. 112, No. 1, 1990.  

1986
E. Suhir, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies”,  Proc. of the Int. Symp. on Microelectronics, ISHM, 1986, Atlanta, Georgia, Oct. 1986.
E. Suhir, “Stresses in Bi-Metal Thermostats”, ASME Journal of Applied Mechanics, vol. 53, No. 3, Sept. 1986. S. Luryi and E. Suhir, “A New Approach to the High-Quality Epitaxial Growth of Lattice - Mismatched Materials”, Applied Physics Letters, vol. 49, No. 3, July 1986.   1985
E. Suhir, “Linear and Nonlinear Vibrations Caused by Periodic Impulses”, AIAA/ASME/ASCE/AHS 26th Structures, Structural Dynamics and Materials Conference, Orlando, Florida, April 1985.  

1982
E. Suhir, “Shock-Excited Vibrations with Application to the Slamming Response of a Flexible Ship to a Regular Wave Packet”, SNAME Journal of Ship Research, vol. 26, No. 4, 1982.  

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